Image Sensor Package Bottom Cover for Substrate Flatness
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Solution Overview
Problem
The unflatness of the lower surface of the substrate in image sensor packages due to passive components affects signal testing yield and is not adequately addressed by disposing components on the side edges, which enlarges the substrate dimension.
Innovation Solution
A bottom cover is added to enclose the passive components, maintaining the flatness of the substrate and improving testing yield by creating a separate containing space for these components.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Quantity of substance
If passive components are disposed on the lower surface of the substrate, then the substrate can accommodate more components, but the lower surface becomes unflat which affects signal testing yield
Solution Approach 1:
The invention divides the substrate structure into two functional levels: the upper surface for mounting the image sensor chip and the lower surface for mounting passive components. This segmentation allows each surface to be optimized independently, with the lower surface specifically designed to accommodate passive components while maintaining overall package flatness through controlled placement and support structures.
Solution Approach 2:
The invention transitions from a two-dimensional planar arrangement to a three-dimensional立体 structure by utilizing both the upper and lower surfaces of the substrate vertically. Passive components are mounted on the lower surface while the chip is mounted on the upper surface, effectively using the Z-dimension to increase component density without compromising the flatness required for signal testing.
2Manufacturing precision
If passive components are disposed on the side edges of the substrate, then the lower surface flatness is maintained, but the substrate dimension increases
Solution Approach 1:
Instead of expanding the substrate horizontally to accommodate passive components on the side edges, the invention utilizes the vertical dimension by mounting passive components on the lower surface of the substrate. This approach maintains the original substrate footprint and dimensions while achieving the required component accommodation through three-dimensional space utilization.
Solution Approach 2:
The lower surface of the substrate serves multiple functions: it acts as a mounting platform for passive components, provides mechanical support for the overall package structure, and maintains the dimensional boundaries required for compact device integration. This multi-functional use of the lower surface eliminates the need to increase substrate dimensions.
Data Source
AI summary
An image sensor package includes a substrate, a lens module and a bottom cover. Herein the substrate has an upper surface and a lower surface, a plurality of passive components is fabricated on the lower surface and a chip is disposed on the upper surface. The lens module is mounted on the substrate and covers the chip. The bottom cover is connected to the lower surface of the substrate to enclose the passive components.