Image Sensor Package Layout for Uniform Endoscope Illumination
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Solution Overview
Problem
Conventional endoscopes are bulky and have low light utilization efficiency due to the placement of light-emitting elements away from the image sensor, leading to non-uniform illumination and potential shadows and blind spots.
Innovation Solution
An image sensor package design where the image sensor protrudes from a second substrate with light-emitting elements disposed near it, allowing for better illumination and miniaturization, achieved through a specific substrate configuration and encapsulation process.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If light-emitting elements are disposed away from the image sensor on a flexible circuit board, then the structure is simpler to manufacture, but the light utilization efficiency is low and illumination is non-uniform
Solution Approach 1:
The patent merges the light-emitting elements and image sensor into a single integrated package structure, where the light-emitting elements are disposed on the same substrate as the image sensor. This integration allows the light-emitting elements to be positioned adjacent to the image sensor, improving light utilization efficiency and providing uniform illumination while maintaining manufacturing simplicity through a unified structure.
Solution Approach 2:
The patent transitions from a planar arrangement on a flexible circuit board to a three-dimensional integrated package structure. The light-emitting elements are positioned in close proximity to the image sensor in multiple spatial dimensions, enabling better light distribution and illumination uniformity while maintaining a compact form factor.
2Device complexity
If light-emitting elements are disposed away from the image sensor, then the fabrication process is simpler, but the endoscope size is larger
Solution Approach 1:
The patent combines the light-emitting elements and image sensor into a single integrated package, eliminating the need for separate mounting on a flexible circuit board. This integration significantly reduces the overall endoscope size while the fabrication process remains straightforward through standard semiconductor manufacturing techniques.
Solution Approach 2:
The light-emitting elements and image sensor are nested within a compact integrated package structure, where components are arranged in a space-efficient manner. This nesting approach minimizes the endoscope size while maintaining all necessary functional components.
3Adaptability or versatility
If light-emitting elements are disposed away from the image sensor, then the structure is more flexible, but shadows and blind spots are more likely to occur
Solution Approach 1:
The integration of light-emitting elements and image sensor in a unified package ensures that the light source is always in optimal proximity to the sensor, eliminating shadows and blind spots. The structure maintains flexibility through the use of flexible substrates while ensuring reliable and uniform illumination.
Solution Approach 2:
The patent implements local optimization by positioning light-emitting elements in specific locations adjacent to the image sensor, ensuring that illumination is concentrated where needed. This local quality approach guarantees uniform lighting across the sensor surface while maintaining overall structural flexibility.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration enhances illumination efficiency and reduces the size of the endoscope, providing more uniform lighting and improved imaging quality by optimizing the relative positions of the image sensor and light-emitting elements.
Implementation Method 1
a light-emitting element disposed on the second substrate and near the image sensor
Implementation Method 2
a first encapsulant filled into a space between the image sensor and the light-emitting element
Data Source
AI summary
An image sensor package includes a first substrate, an image sensor, a second substrate, a light-emitting element, and a first encapsulant. The image sensor is disposed on and electrically connected with the first substrate. The second substrate is disposed on and electrically connected with the first substrate, wherein the second substrate includes an accommodating portion and the image sensor protrudes from the second substrate via the accommodating portion. The light-emitting element is disposed on the second substrate and close to the image sensor, and is electrically connected to the second substrate. The first encapsulant is filled in a space between the image sensor and the light-emitting element. The abovementioned image sensor package can achieve miniaturization and provide better illumination. An endoscope including the abovementioned image sensor package is also disclosed.