Image Sensor Package Layout for Heat Dissipation and Low Interface Delay
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Solution Overview
Problem
Existing solid-state imaging devices face challenges in heat dissipation and package size increase due to high pixel density and frame rate, leading to transmission delays in high-speed interfaces, with complex configurations and increased component count.
Innovation Solution
A solid-state imaging device with a substrate-mounted image sensor, surrounded by a support member and connectors positioned outside the image sensor arrangement, featuring a recess and stepped portions to reduce package size and minimize transmission delays.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If a metal plate is interposed between the housing and substrate to dissipate heat, then heat dissipation is improved, but package size increases
Solution Approach 1:
The patent combines the connector support function and heat dissipation function into a single integrated connector structure. The connector body directly contacts the image sensor to conduct heat away, while simultaneously providing electrical connection, eliminating the need for separate heat dissipation components and reducing package size.
Solution Approach 2:
The connector is designed to serve multiple functions: electrical connection, mechanical support, and heat dissipation. By making the connector body itself the heat dissipation path, the design achieves multi-functionality without increasing component count or package dimensions.
2Temperature
If electrode terminals are extended on the back side of the housing to secure space, then heat dissipation path is improved, but wiring length increases causing transmission delay
Solution Approach 1:
The patent extracts the heat dissipation function from the housing structure and integrates it directly into the connector body. This allows the heat dissipation path to be established through the connector itself, eliminating the need for extended electrode terminals and long wiring paths that would cause transmission delays.
Solution Approach 2:
The patent transitions from a linear heat dissipation path through extended terminals to a three-dimensional heat conduction path through the connector body and substrate. This spatial reorganization allows heat to be dissipated vertically through the connector structure rather than requiring extended horizontal wiring paths.
3Temperature
If the package size is increased for heat dissipation, then heat dissipation is improved, but wiring length increases causing transmission delay
Solution Approach 1:
The patent merges the heat dissipation function with the existing connector structure, eliminating the need for separate heat dissipation components. The connector body serves as both the electrical connection interface and the heat conduction path, preventing any increase in package size or wiring length.
4Temperature
If heat dissipation components are added to the housing, then heat dissipation is improved, but device complexity increases
Solution Approach 1:
The patent combines multiple functions (electrical connection, mechanical support, and heat dissipation) into the connector body, eliminating the need for separate heat dissipation components. This integration reduces the total number of parts and simplifies the overall device structure.
Solution Approach 2:
The connector is designed as a multi-functional component that simultaneously provides electrical connection, mechanical support, and heat dissipation. This universality reduces device complexity by eliminating the need for multiple specialized components.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively dissipates heat while maintaining a compact package size and reducing transmission delays through a simplified structure.
Implementation Method 1
an image sensor which is a solid-state imaging element having a plurality of light receiving elements constituting a pixel formed on one plate surface side of a semiconductor substrate
Implementation Method 2
heat generation increases as the number of pixels of an image sensor increases and the frame rate increases
Data Source
AI summary
To cope with heat generation of a solid-state imaging element, a package size is reduced with a simple structure, and a transmission delay of a high-speed interface is suppressed. A solid-state imaging device includes: a solid-state imaging element in which one plate surface side of a semiconductor substrate is a light receiving side; a substrate on which the solid-state imaging element is mounted on a front surface that is one plate surface; a support member provided on the front surface side of the substrate so as to surround the solid-state imaging element; and a plurality of connectors provided on a back surface that is another plate surface of the substrate and positioned outside an arrangement region of the solid-state imaging element on the substrate, in which at least a part of the connector is positioned outside an arrangement region of the support member on the substrate.