Image Sensor Package Substrate Integration for Camera Module Miniaturization
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Solution Overview
Problem
Conventional camera modules are hindered by the need for a circuit board, which obstructs miniaturization due to the requirement for interconnecting image sensor packages and passive components.
Innovation Solution
An image sensor package design featuring a substrate with an imaging area on one surface and a circuit layer on the opposite surface, where passive components are soldered to the circuit layer, allowing for miniaturization by eliminating the need for a separate circuit board.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If a circuit board is used to support the image sensor package and passive components, then the interconnection between components is established, but the camera module size increases and miniaturization is obstructed
Solution Approach 1:
The patent merges the circuit board function with the image sensor package substrate. The substrate serves dual purposes: supporting the image sensor and providing the circuit layer for passive components, eliminating the need for a separate circuit board and enabling miniaturization while maintaining interconnection capabilities
Solution Approach 2:
The substrate is designed with multi-functionality, serving as both the mechanical support for the image sensor and the electrical circuit carrier for passive components. This universal structure replaces the traditional separate circuit board, reducing overall module size while preserving all necessary functions
2Adaptability or versatility
If passive components are soldered to a separate circuit board, then the circuit functionality is achieved, but the overall device complexity and size increase
Solution Approach 1:
The patent combines the passive components directly onto the substrate's circuit layer, merging the component mounting function with the substrate structure. This integration reduces structural complexity by eliminating the separate circuit board layer while maintaining complete circuit functionality
Solution Approach 2:
The patent utilizes the vertical dimension of the substrate by forming the circuit layer on the back surface opposite the image sensing area. This dimensional arrangement allows passive components to be soldered on one side while the image sensor operates on the other, achieving circuit functionality without increasing structural complexity
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables the miniaturization of camera modules by integrating the circuit layer and passive components directly onto the substrate, reducing the overall size and enhancing compactness.
Implementation Method 1
The passive components opposite to the image sensing area are soldered to the circuit layer of the second surface
Data Source
AI summary
An exemplary image sensor package includes a substrate, an imaging area, a circuit layer and two passive components. The substrate has a first surface and a second surface, which are opposite to each other. An image sensing area is formed on the first surface of the substrate and a circuit layer is formed on the second surface of the substrate. The passive components opposite to the image sensing area are soldered to the circuit layer of the second surface.