Image Sensor Package Supporting Brick Insulator

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Solution Overview

Problem

Existing image sensor packages face challenges in maintaining the integrity of photosensitive devices due to the interference from conductive traces and bonding pads, which can affect the light sensing capability and signal transfer.

Innovation Solution

The electronic device package incorporates a supporting brick separated from the substrate by an insulator, with a conductive trace layer extending to the sidewall of the bonding pad and supporting brick to ensure electrical connection without interfering with the photosensitive device, and a conductive bump for enhanced signal transfer, while simplifying the manufacturing process through wafer-level packaging.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Strength

If a supporting brick is added to strengthen the package structure, then the mechanical strength is improved, but the complexity of the package structure increases

Engineering Contradiction:

Improvemechanical strengthVSAvoidpackage structure complexity

Core Design Contradiction:

StrengthVSDevice complexity

Solution Approach 1:

The supporting brick is integrated within the package structure by attaching it to the back surface of the substrate, nesting the reinforcement element within the existing package footprint rather than adding external support structures

Inventive Principle:

Principle #7Nested doll (Nesting)

Solution Approach 2:

An insulator is introduced as an intermediary component between the supporting brick and the substrate, enabling mechanical attachment while preventing electrical interference with the photosensitive device

Inventive Principle:

Principle #24Intermediary (Mediator)

2Reliability

If conductive traces are extended to the bonding pad and supporting brick, then the electrical connection is improved, but the interference with the photosensitive device increases

Engineering Contradiction:

Improveelectrical connectionVSAvoidinterference with photosensitive device

Core Design Contradiction:

ReliabilityVSObject-affected harmful factors

Solution Approach 1:

The insulator is selectively placed only in the region between the supporting brick and the photosensitive device area, providing electrical isolation where needed while maintaining conductivity elsewhere in the package

Inventive Principle:

Principle #3Local quality

Solution Approach 2:

The insulator material is extracted and placed specifically in the critical isolation zone, separating the electrical domains of the supporting brick and the photosensitive device

Inventive Principle:

Principle #2Taking out (Extraction)

3Ease of manufacture

If wafer-level packaging is used to simplify manufacturing, then the manufacturing complexity is reduced, but the precision of individual device fabrication may be compromised

Engineering Contradiction:

Improvemanufacturing process simplicityVSAvoiddevice fabrication precision

Core Design Contradiction:

Ease of manufactureVSManufacturing precision

Solution Approach 1:

The wafer is divided into multiple die regions, each containing a complete device package structure, allowing parallel processing of multiple devices while maintaining individual device integrity through the segmented design

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

The supporting brick and insulator structure are formed preliminarily during wafer-level processing, establishing the mechanical and electrical framework before individual device attachment and final packaging steps

Inventive Principle:

Principle #10Preliminary action

Data Source

PatentUS8097929B2Electronics device package and fabrication method thereof

Publication Date: 2012.01.17 XINTEC INC

AI summary

Embodiments provide an electronic device package and a method for fabricating thereof. A semiconductor chip has a substrate. A supporting brick is separated from the substrate by a certain distance. A bonding pad having a surface is disposed across the substrate and the supporting brick.