Image Sensor Packaging Structure for Warp- and Crack-Resistant Mounting
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Solution Overview
Problem
Existing packaging structures for image sensors face issues with warping and cracking due to external forces in ceramic substrates and the generation of fragments that can affect imaging quality when using rigid-flexible circuit boards.
Innovation Solution
A packaging structure comprising a flexible circuit board, an image sensor, a reinforcing plate, and an adhesive layer, where the image sensor is disposed on the flexible circuit board, and the reinforcing plate surrounds the periphery, enhancing the board's strength and flatness, and the adhesive layer bonds all components together, preventing fragment generation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a ceramic substrate is used to package the image sensor, then the electrical connection between the image sensor and circuit board is achieved, but the substrate is easily warped and cracked when external force is applied
Solution Approach 1:
The patent changes the material parameter of the substrate from rigid ceramic to flexible polymer-based material. The flexible circuit board uses a polymer substrate with copper foil layers, fundamentally changing the mechanical properties from rigid and fragile to flexible and durable, eliminating warping and cracking issues while maintaining electrical connection reliability
Solution Approach 2:
The patent employs a composite structure consisting of a polymer substrate combined with copper foil layers to create the flexible circuit board. This composite material provides both the flexibility needed to avoid warping/cracking and the electrical conductivity required for reliable connections between the image sensor and circuit board
2Ease of manufacture
If an opening is defined at the rigid portion of the circuit board to dispose the image sensor, then the image sensor can be mounted, but fragments are generated which may drop on the image sensor and affect imaging quality
Solution Approach 1:
The patent replaces the rigid circuit board with a flexible circuit board made of polymer material. This flexible substrate eliminates the fragment generation problem during opening definition while still providing precise mounting capability for the image sensor, as the flexible material can be processed without generating harmful fragments that would affect imaging quality
Solution Approach 2:
The patent uses a flexible polymer-based circuit board that can be easily processed and discarded if needed, replacing the expensive and problematic rigid circuit board with opening definition issues. The flexible material allows for easier manufacturing without compromising imaging quality
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution provides a stable packaging structure that maintains the flatness of the flexible circuit board, preventing warping and cracking, and ensures the image sensor's integrity by eliminating fragment generation, thus enhancing imaging quality.
Implementation Method 1
an adhesive layer, wherein the adhesive layer bonds together the flexible circuit board, the image sensor, and the reinforcing plate
Data Source
AI summary
A packaging structure for an image sensor used in an electronic device includes a flexible circuit board, a reinforcing plate, an image sensor, and an adhesive layer. The reinforcing plate is disposed on the flexible circuit board. The image sensor is disposed in the reinforcing plate. The adhesive layer bonds the flexible circuit board, the reinforcing plate, the image sensor and the conductor.