Configurable Image Sensor Pad Structure for Multi-Interface Adaptation
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Solution Overview
Problem
Existing image sensors require design changes to accommodate different device interfaces, such as D-PHY and C-PHY, which complicates their integration with various external processors and limits their versatility and expandability.
Innovation Solution
The image sensor incorporates a configurable pad structure with signal and dummy pads that can be dynamically configured based on the interface requirements, allowing it to support multiple interfaces like D-PHY and C-PHY without altering its design, by determining which pads function as signal or dummy pads based on control commands from external devices.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If the image sensor uses a fixed pad configuration for a specific interface, then the interface compatibility is limited, but the design complexity is reduced
Solution Approach 1:
The image sensor is designed with a universal pad configuration that can function with multiple different interfaces (D-PHY, C-PHY, and other custom interfaces). The sensor includes a comprehensive set of pads that can be dynamically assigned different roles based on the connected device's interface requirements, allowing one sensor design to serve multiple interface standards without requiring separate dedicated pad sets for each interface type.
Solution Approach 2:
The pad configuration is made dynamic through software-controlled assignment rather than fixed hardware designation. The image sensor includes control logic that can dynamically determine which pads function as data pads, clock pads, or power pads based on the detected interface type. This dynamic reconfiguration capability allows the same physical pad structure to adapt its functionality according to the connected device's requirements, resolving the contradiction between versatility and design complexity.
2Adaptability or versatility
If the image sensor includes all possible pad types for multiple interfaces, then the interface versatility is improved, but the pad layout complexity increases
Solution Approach 1:
The pad configuration is segmented into functional groups that can be independently configured. The sensor includes separate data pads, clock pads, and power pads that can be independently assigned or deactivated based on the interface type. This segmentation allows the comprehensive pad set to be organized in a systematic manner, reducing layout complexity while maintaining the capability to support multiple interfaces through selective activation of appropriate pad groups.
Solution Approach 2:
The functionality of pads is changed through software parameters rather than hardware reconfiguration. By modifying control registers and configuration bits, the same physical pad structure can change its operational parameters to match different interface requirements. This parameter-based configuration approach simplifies the physical layout while maintaining interface versatility, as the complexity is managed through software rather than requiring complex physical routing for each interface variant.
3Reliability
If the image sensor is redesigned for each interface type, then the interface-specific performance is optimized, but the manufacturing cost and time increase
Solution Approach 1:
A single universal image sensor design replaces the need for multiple interface-specific sensor variants. The sensor incorporates a comprehensive pad structure that can accommodate D-PHY, C-PHY, and other interfaces through software configuration, eliminating the need for separate production lines and quality assurance processes for different interface types. This universal design maintains interface-specific performance through proper signal routing while significantly improving manufacturing efficiency by standardizing the production process.
Solution Approach 2:
Instead of creating dedicated hardware for each interface, the design discards the approach of interface-specific pad configurations and recovers resources by using a single standardized pad layout. The comprehensive pad set includes all necessary connections for multiple interfaces, but only the required subset is activated for each specific application, reducing manufacturing complexity while maintaining the ability to optimize for interface-specific performance when needed.
Data Source
AI summary
A semiconductor memory device includes a pixel array having pixels, a logic circuit configured to process a signal output by the pixels to generate image data, and sensor pads connected to the logic circuit, where the sensor pads include a first ground sensor pad, a second ground sensor pad, signal sensor pads disposed between the first ground sensor pad and the second ground sensor pad and configured to output the image data, and dummy sensor pads disposed between the first ground sensor pad and the second ground sensor pad and configured not to output the image data, and at least one of the dummy sensor pads is disposed between the signal sensor pads.