Image Sensor Package Pillar Spacers for Precise Gap Height
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Conventional methods for controlling the gap height in image sensor packages are inaccurate due to dependence on the volume and viscosity of bonding materials, leading to variations in production.
Innovation Solution
The method involves forming pillar members on the image sensor die, dispensing bonding material to cover these pillars, and then curing it to define a precise gap height by controlling the position of a transparent member using a bond head with vacuum suction, ensuring the gap height is determined by the pillar height rather than the bonding material's properties.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If bonding material is dispensed and glass substrate is dropped on it, then the gap height is formed, but the gap height varies due to dependence on resin volume and viscosity
Solution Approach 1:
Pillar members are formed on the image sensor die before dispensing the bonding material. These pre-formed pillars serve as mechanical stops that define the gap height, eliminating dependence on bonding material volume and viscosity variations during assembly.
Solution Approach 2:
The pillar members act as intermediary structures between the image sensor die and the glass substrate. They mediate the gap formation process by providing a fixed mechanical reference that decouples the gap height from the bonding material properties.
2Ease of manufacture
If gap height depends on bonding material volume and viscosity, then assembly is simple, but manufacturing accuracy deteriorates
Solution Approach 1:
The pillar members are pre-formed on the die surface before bonding material application. This preliminary structuring allows the assembly process to remain simple (dropping the glass substrate) while achieving high gap height accuracy through the mechanical reference provided by the pillars.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach allows for precise control of the gap height, reducing variations and improving manufacturing accuracy by decoupling the gap height from the bonding material's volume and viscosity, resulting in more consistent image sensor packages.
Implementation Method 1
The liquid epoxy resin is cured using ultraviolet (UV) light
Implementation Method 2
curing the bonding material to couple the transparent member to the image sensor die
Implementation Method 3
a bond head with vacuum suction, ensuring the gap height is determined by the pillar height
Data Source
AI summary
According to an aspect, an image sensor package includes a substrate, an image sensor die coupled to the substrate, a light transmitting member, and a plurality of pillar members disposed between and contacting the image sensor die and the light transmitting member. A height of the plurality of pillar members defines a gap height between an active region of the image sensor die and the light transmitting member. The image sensor package including a bonding material that couples the light transmitting member to the image sensor. The bonding material contacts a side of a pillar member, of the plurality of pillar members, that extends between a first end contacting the light transmitting member and a second end contacting the image sensor die.