Solid State Image Sensor Pixel Electrode Shielding Capacitive Coupling
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Solution Overview
Problem
Signal mixture due to electric capacitive coupling between adjacent pixels in solid state image sensors reduces resolution and causes color mixture, especially when there is a large potential difference between charge accumulation units in surrounding pixels.
Innovation Solution
Incorporating an additional electrode between the lower electrodes of adjacent pixels in a solid state image sensor, which shields capacitive coupling and allows for independent voltage control of each pixel, thereby reducing signal mixture and improving resolution.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If adjacent pixels are arranged closely to increase pixel density, then productivity and sensor resolution are improved, but signal mixture due to electric capacitive coupling between adjacent pixels increases
Solution Approach 1:
A ground electrode is introduced as an intermediary element between adjacent pixel electrodes. This ground electrode acts as a mediator that intercepts and dissipates electric field lines that would otherwise couple adjacent pixels, thereby reducing capacitive coupling while allowing pixels to be arranged closely for high density
2Use of energy by moving object
If the photoelectric conversion film thickness is increased to improve photoelectric conversion efficiency, then energy conversion is improved, but manufacturing precision and device complexity increase
Solution Approach 1:
The patent optimizes the thickness parameter of the photoelectric conversion film to achieve high photoelectric conversion efficiency without excessive thickness. Additionally, the ground electrode structure compensates for thinner film designs by reducing signal loss and interference, allowing flexible optimization of the thickness parameter within a broader range
3Reliability
If a ground electrode is added between adjacent pixels to reduce capacitive coupling, then signal mixture is reduced, but device complexity increases
Solution Approach 1:
The ground electrode is merged with the existing electrode structure by forming it in the same layer as the pixel electrodes using the same material and fabrication process. This integration approach reduces device complexity by eliminating separate ground electrode layers and simplifying the manufacturing process
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively reduces signal mixture and enhances spatial resolution and color separation by controlling the voltage difference between adjacent pixels, improving the reliability and photoelectric conversion characteristics of the image sensor.
Implementation Method 1
each of the first pixel and the second pixel having a photoelectric conversion film for photoelectrically converting an incident light
Implementation Method 2
signal mixture occurs due to electric capacitive coupling between adjacent pixels
Data Source
AI summary
Provided is a solid state image sensor capable of reducing signal mixture due to electric capacitive coupling between adjacent pixels, a method for manufacturing the same, and an electronic device. A first pixel and a second pixel are adjacently arranged in the solid state image sensor. Each of the first pixel and the second pixel has a photoelectric conversion film for photoelectrically converting an incident light, and a lower electrode arranged below the photoelectric conversion film, and another electrode different from the lower electrodes is provided between the lower electrodes of the first pixel and the second pixel. The present disclosure is applicable to solid state image sensors and the like, for example.