Semiconductor Image Sensor Pixel Heating for Temperature Homogeneity
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Solution Overview
Problem
Semiconductor image sensors face non-uniformity issues due to local temperature differences caused by leakage current and responsivity variations, which existing methods struggle to address effectively, especially when photo sensors are integrated near heat-generating components.
Innovation Solution
Integration of heaters within or near pixels of the semiconductor image sensor, along with optional readout circuits and temperature sensors, allows for localized temperature control to maintain spatial and temporal temperature homogeneity, with heaters arranged between photo sensors and readout circuits or surrounding them, and through-substrate vias for electrical connection.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If the whole image sensor chip is heated or cooled to maintain constant temperature, then spatial and temporal temperature constancy is improved, but the complexity of the temperature control system increases and energy consumption increases
Solution Approach 1:
The patent divides the temperature control function into segmented heating zones corresponding to different pixel groups or regions. Each heating zone can be independently controlled, allowing localized temperature adjustment rather than heating the entire chip, thus reducing overall system complexity and energy consumption while maintaining temperature constancy where needed.
Solution Approach 2:
The patent implements local heating elements positioned specifically near heat-generating components such as readout circuits. This allows temperature compensation only in the affected local regions rather than uniformly heating the entire sensor chip, reducing the complexity and energy requirements of the temperature control system while maintaining optimal temperature conditions for photo sensors.
2Adaptability or versatility
If photo sensors are integrated in the vicinity of heat-generating components, then integration density is improved, but local temperature differences increase causing pixel non-uniformity
Solution Approach 1:
The patent applies local heating elements positioned specifically near heat-generating components like readout circuits to compensate for local temperature differences. This allows the system to maintain high integration density while actively managing temperature uniformity in affected regions through targeted thermal compensation.
Solution Approach 2:
The patent implements preliminary heating compensation near heat-generating components before temperature differences significantly affect photo sensor performance. By anticipating and counteracting the thermal impact of integrated circuits, the system maintains temperature uniformity despite high integration density.
3Temperature
If conventional heating methods are used for the entire chip, then temperature homogeneity is improved, but energy consumption increases and response time decreases
Solution Approach 1:
The patent segments the heating function into multiple independent heating zones or elements positioned at specific locations on the chip. This allows energy to be applied only where needed rather than heating the entire chip, significantly reducing energy consumption while maintaining temperature homogeneity in the photo sensor regions through coordinated local heating.
Solution Approach 2:
The patent implements localized heating elements positioned near heat-generating components and photo sensor regions. By concentrating heating energy only in the regions requiring temperature control rather than uniformly heating the entire chip, the system achieves temperature homogeneity with substantially reduced energy consumption.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enables independent heating of different pixel areas, reducing temperature non-uniformities and improving image production by maintaining optimal temperature conditions, thereby minimizing pixel-to-pixel variations and ensuring consistent performance.
Implementation Method 1
An appropriate operation of the heater will increase the temperature of the photo sensor of the relevant pixel
Implementation Method 2
A further embodiment comprises an integrated temperature sensor, which may especially be arranged in the vicinity of one of the photo sensors
Data Source
AI summary
The semiconductor image sensor comprises a plurality of pixels (1) with photo sensors (2). At least one heater (4) is integrated with the photo sensors and is arranged in at least one of the pixels or in the vicinity of at least one of the pixels. An appropriate operation of the heater will increase the temperature of the relevant pixel. Thus it is possible to achieve a local compensation of a temperature difference that may be due to the operation of an integrated readout circuit (3) or any other integrated component generating heat.