Backside Image Sensor and Processor Bonding for Lower Signal Delay
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Solution Overview
Problem
The conventional image sensor devices experience significant signal propagation delay due to the distance between the image sensor and separate controller or processor chips, which negatively impacts camera performance.
Innovation Solution
The image sensor device is integrated with a processor die in a common package, eliminating the need for separate chips by bonding the image sensor wafer and processor die directly through metallic pads, and forming channels and vias on the back side of the substrate to reduce signal propagation delay and enable a low-profile design.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the image sensor is coupled to a separate controller chip, then the controller can control sensor sensing time and thresholds, but the distance between components causes signal propagation delay that negatively impacts performance
Solution Approach 1:
The patent combines the image sensor and controller into a single integrated device, eliminating the separate controller chip and its associated signal propagation delays. The controller is now part of the image sensor device itself, allowing control functions to be performed without external communication overhead.
2Adaptability or versatility
If separate chips are used for image sensor, driver, and image processor, then each component can be optimized independently, but the overall device size and complexity increase
Solution Approach 1:
The patent integrates multiple previously separate components (image sensor, driver, and image processor) into a single unified device. This consolidation reduces the number of separate chips and interconnections required, simplifying the overall device architecture while maintaining the functional capabilities of each component.
3Adaptability or versatility
If multiple separate chips are mounted on a circuit platform, then functional versatility is achieved, but the distance between components increases propagation delay
Solution Approach 1:
The patent merges the image sensor, driver, and image processor into a single integrated device, eliminating the need for multiple separate chips mounted on a circuit platform. This integration ensures that all control signals and data transfers occur within the same device, minimizing propagation delays while maintaining full camera functionality.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This integration reduces signal propagation delay and allows for a more compact, efficient camera design with improved performance by minimizing the distance between the image sensor and processor components.
Implementation Method 1
The reconstituted wafer and the image sensor wafer are bonded to one another including coupling the first surface of the first dielectric layer and the second surface of the second dielectric layer
Data Source
AI summary
Methods of forming a back side image sensor device, as well as back side image sensor devices formed, are disclosed. In one such a method, an image sensor wafer having a first dielectric layer with a first surface is obtained. A reconstituted wafer having a processor die and a second dielectric layer with a second surface is obtained. The reconstituted wafer and the image sensor wafer are bonded to one another including coupling the first surface of the first dielectric layer and the second surface of the second dielectric layer. In another method, such formation is for a processor die bonded to an image sensor wafer. In yet another method, such formation is for a processor die bonded to an image sensor die.