Image Sensor Package Scattering Layer for Uniform Endoscope Illumination
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Solution Overview
Problem
Conventional endoscopes suffer from low light utilization efficiency, non-uniform illumination, and the likelihood of shadows and blind spots due to the inefficient placement of light-emitting elements relative to the image sensor, which complicates the structure and fabrication process and results in a larger size.
Innovation Solution
An image sensor package with a scattering layer surrounding the light-emitting elements, which scatters the illumination light to enhance light utilization efficiency and provide more uniform illumination, allowing the light-input and light-output surfaces to be oriented in the same direction.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If light-emitting elements are disposed around the image sensor in conventional endoscopes, then the structure is more complicated and the size is larger, but the light utilization efficiency is low and illumination is non-uniform
Solution Approach 1:
The patent combines the light-emitting elements and image sensor into a single integrated package structure, eliminating the need for separate disposal of these elements around the sensor. This merging approach simplifies the overall structure while improving light utilization efficiency by directing illumination light directly onto the sensor through the scattering layer.
Solution Approach 2:
The scattering layer acts as an intermediary between the light-emitting elements and the image sensor. It receives illumination light from the light-emitting elements and scatters it uniformly onto the sensor surface, resolving the issue of non-uniform illumination while maintaining a compact structure.
2Device complexity
If light-emitting elements are disposed around the image sensor in conventional endoscopes, then the structure is more complicated and the size is larger, but the illumination uniformity is poor with shadows and blind spots
Solution Approach 1:
The integrated package structure merges light-emitting elements and image sensor into a compact unit, reducing device complexity while the scattering layer ensures uniform illumination distribution across the sensor surface, eliminating shadows and blind spots.
Solution Approach 2:
The scattering layer serves as a mediating optical element that receives light from the light-emitting elements and redistributes it uniformly across the image sensor, achieving homogeneous illumination without requiring complex spatial arrangement of light sources.
3Volume of moving object
If the light-output surfaces of the light-emitting elements do not face upwards, then the structure is compact, but the light utilization efficiency is low
Solution Approach 1:
The scattering layer acts as an intermediary that captures light output from the light-emitting elements regardless of their orientation and redirects it uniformly onto the image sensor. This allows the light-emitting elements to be positioned in a compact arrangement without sacrificing light utilization efficiency.
Solution Approach 2:
The scattering layer changes the directional parameters of the illumination light, converting light that would otherwise be directed in specific orientations into uniformly distributed light across the sensor surface, thereby maintaining efficiency in a compact configuration.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution increases light utilization efficiency and provides more uniform illumination, improving the imaging quality by ensuring that the illumination light is directed effectively towards the image sensor, reducing shadows and blind spots.
Implementation Method 1
a scattering layer surrounds the light-emitting elements, whereby the illumination light generated by the light-emitting elements is partially stopped by the scattering layer
Data Source
AI summary
An image sensor package includes a substrate, an image sensor, a plurality of light-emitting elements, and a scattering layer. The substrate includes a plurality of first conductive contacts, a plurality of second conductive contacts, and a plurality of third conductive contacts, wherein the second conductive contacts and the third conductive contacts are electrically connected with the corresponding first conductive contacts. The image sensor is disposed on the substrate and electrically connected to the second conductive contacts. The light-emitting elements are disposed on the substrate and electrically connected with the third conductive contacts. The scattering layer covers at least one sidewall of the light-emitting elements. The abovementioned image sensor package can provide better illumination effects. An endoscope including the abovementioned image sensor package is also disclosed.