Image Sensor Assembly With Segmented Covers for Clean Manufacturing
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing image sensor devices face challenges in reducing the risks of damage and contamination during manufacturing, particularly due to handling issues with long translucent covers and complex positioning structures.
Innovation Solution
The image sensor device features a substrate with sensor units arranged in a linear fashion, each including a pixel chip covered by a short translucent plate and a spacer, with a positioning structure using pins, bolts, and nuts for precise alignment and secure mounting, reducing the risk of damage and contamination.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If a long translucent cover is used to cover multiple pixel chips, then the manufacturing process can be simplified, but the risk of damage and contamination to components increases
Solution Approach 1:
The patent divides the single long translucent cover into multiple short translucent covers, each covering individual pixel chips. This segmentation reduces the handling complexity and damage risk while maintaining the protective function across all chips.
Solution Approach 2:
The patent introduces spacers as intermediary components between the pixel chips and translucent covers. These spacers facilitate precise positioning and secure mounting, reducing handling risks during assembly while enabling simplified manufacturing processes.
2Manufacturing precision
If a complex positioning structure is used to align substrate and sensor units, then positioning precision is improved, but device complexity and manufacturing difficulty increase
Solution Approach 1:
The positioning structure utilizes the pixel chip itself as a positioning reference, eliminating the need for separate complex positioning mechanisms. The pixel chip's inherent features guide the alignment of the translucent cover and mounting substrate, achieving high positioning precision with minimal additional components.
Solution Approach 2:
The spacers serve as intermediary positioning elements that bridge the pixel chips and mounting substrates. These spacers provide precise spacing and alignment references, enabling accurate positioning without requiring complex positioning structures.
3Stability of the object's composition
If pixel chips are tightly mounted to substrate, then structural stability is improved, but thermal expansion mismatch causes deformation and peeling
Solution Approach 1:
The patent pre-designs the mounting structure with intentional spacing between pixel chips and mounting substrates using spacers. This preliminary spacing accommodation allows for thermal expansion differences without causing deformation or peeling, while maintaining structural stability through secure mounting at designated points.
Solution Approach 2:
The patent changes the mounting parameters by introducing controlled spacing through spacers rather than tight mounting. This parameter adjustment accommodates thermal expansion coefficients differences between materials, preventing deformation and peeling while maintaining overall structural stability.
Data Source
AI summary
It is a main object to provide an image sensor device that can reduce the risks of damage to and/or contamination of its components during manufacturing. The image sensor device according to the present technology is an image sensor device including a substrate and a plurality of sensor units arranged in at least one axis direction on the substrate. Each of the plurality of sensor units includes a pixel chip including a plurality of pixels, and a translucent cover configured to cover the pixel chip. With the image sensor device according to the present technology, there can be provided an image sensor device that can reduce the risks of damage to and/or contamination of its components during manufacturing.