Image Sensor Heat Path Using Integrated Sheet Metal Arm
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Solution Overview
Problem
Existing image pickup apparatuses face challenges in efficiently dissipating heat without increasing their size, particularly in compact designs, as conventional heat dissipation methods often limit the conduction paths and may not suffice for high-power operations.
Innovation Solution
The apparatus incorporates a first sheet metal member with an arm portion extending towards the back surface, thermally connected to the image pickup device board, and a battery chamber, forming a heat transfer path that efficiently dissipates heat without enlarging the device.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If a flexible heat transfer member connects the heat generating element to the chassis member, then heat dissipation efficiency is improved, but the device size increases
Solution Approach 1:
The patent combines multiple heat dissipation functions into a single integrated heat dissipation member that includes both the heat transfer path and the heat radiation surface. This merging eliminates the need for separate flexible heat transfer members and chassis modifications, achieving effective heat dissipation without increasing device volume.
Solution Approach 2:
The patent extends the heat dissipation approach from one-dimensional heat transfer (through the flexible member) to two-dimensional heat radiation by incorporating a heat radiation surface in the radial direction. This dimensional expansion allows heat to be dissipated across a larger area without increasing the axial length of the device.
2Device complexity
If the chassis member is used as the sole heat conduction destination, then structural simplicity is maintained, but heat dissipation performance is insufficient for high-power operations
Solution Approach 1:
The patent segments the heat dissipation function into distinct components: a heat transfer path for conducting heat from the heat generating element, and a separate heat radiation surface for dissipating heat to the surroundings. This segmentation allows each component to be optimized for its specific function while maintaining overall structural simplicity.
Solution Approach 2:
The patent introduces a heat dissipation member as an intermediary component between the heat generating element and the chassis. This intermediary provides a dedicated heat transfer path and heat radiation surface, improving heat dissipation performance without requiring complex modifications to the chassis structure.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration enhances heat dissipation performance, allowing for prolonged continuous shooting times without increasing the device's size, by efficiently transferring heat generated by the image pickup device and electronic components to the exterior.
Implementation Method 1
the first sheet metal member is thermally connected to the image pickup device board
Data Source
AI summary
An image pickup apparatus having high heat dissipation performance. The image pickup apparatus comprises a board having an image pickup device, a sheet metal member disposed closer to a front surface side than the board and adjacent to the board in an optical axis direction, an electronic component board disposed closer to a back surface side than the board, and a battery chamber disposed near an outer edge of the board. The sheet metal member is thermally connected to the board, and includes an arm, which is formed integrally with and made of the same material with the sheet metal member. The arm extends in the optical axis direction toward the back surface side, to a position closer to the back surface side than the board, and is disposed at a position closer to the optical axis than the battery chamber.