Image Sensor Shielding Interconnects for Pixel Density
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Highly integrated image sensors with small-sized pixels produce insufficient photocharges, leading to decreased image resolution due to inadequate electron conversion gain.
Innovation Solution
The design incorporates signal interconnects and shielding interconnects to improve electron conversion gain by applying voltage to the shielding interconnects, optimizing pixel operations and increasing resolution and sharpness.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If pixels are made smaller to increase integration, then pixel density increases, but photocharge production becomes insufficient leading to decreased image resolution
Solution Approach 1:
The patent changes the electrical parameters of the pixel by introducing shielding interconnects that apply voltage to the floating diffusion region. This voltage application modifies the electric field distribution, enabling small pixels to generate sufficient photocharges despite their reduced size, thus maintaining image resolution while achieving high pixel density
2Measurement precision
If shielding interconnects are added to improve electron conversion gain, then voltage boosting is achieved, but device complexity increases
Solution Approach 1:
The shielding interconnects serve multiple functions: they provide voltage boosting to enhance electron conversion gain, acts as shielding to reduce noise, and integrate with existing pixel structures. This multi-functionality allows the additional interconnects to justify their presence by delivering multiple benefits rather than adding complexity for a single purpose
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution enhances the conversion of electrons into voltage, even with a small amount of electrons transferred, thereby improving image forming capability and resolution.
Implementation Method 1
Some embodiments of the disclosed technology provide a method capable of boosting a voltage by coupling the signal interconnects
Data Source
AI summary
An image sensor includes one or more first unit pixels. Each of the one or more first unit pixels may include a first photoelectric conversion region including first photoelectric conversion elements arranged in the form of a matrix, and a first floating diffusion region at a center of the first photoelectric conversion elements; a first transistor region including a first active region in which a first reset gate, a first select gate and a first drive gate are disposed; a first signal interconnect electrically connecting the first floating diffusion region to the first drive gate; and a first shielding interconnect separated from the first signal interconnect and extending parallel to the first signal interconnect.