Image Sensor Module Shielding Static and Electromagnetic Interference
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Solution Overview
Problem
Image sensor modules face interference from static electricity and electromagnetic signals due to the ceramic substrate, which degrades image quality.
Innovation Solution
The camera module incorporates a supporting plate with a metal layer, a rigid-flex board, and metal sheets to conduct static electricity and shield electromagnetic signals, while using a flip-chip package to position the image sensor between the supporting plate and the rigid-flex board, ensuring effective signal output and image quality.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a ceramic substrate is used to support the image sensor, then the image sensor can be positioned and connected, but static electricity and electromagnetic signals interfere with the image sensor, degrading image quality
Solution Approach 1:
A ground plate is introduced as an intermediary component between the ceramic substrate and the image sensor. The ground plate provides a dedicated path for static electricity and electromagnetic signals, preventing them from interfering with the image sensor while maintaining the structural support function.
Solution Approach 2:
The harmful electromagnetic and static electricity functions are extracted from the ceramic substrate by introducing a separate ground plate. This separates the support function (ceramic substrate) from the electromagnetic interference function (ground plate), allowing each to perform its specific role without negative interactions.
2Ease of manufacture
If the image sensor is positioned by flip-chip package between supporting plate and ceramic substrate, then connection is achieved, but electromagnetic signals from the ceramic substrate interfere with image sensor operation
Solution Approach 1:
The ground plate serves as a mediator positioned between the ceramic substrate and the image sensor during flip-chip packaging. It maintains the ease of manufacturing assembly while providing electromagnetic shielding to protect the image sensor from interference.
Solution Approach 2:
The support structure is segmented into multiple functional components: the ceramic substrate for structural support, the ground plate for electromagnetic shielding, and the supporting plate for mechanical stability. This segmentation allows each component to perform its specific function without interfering with others.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration effectively reduces interference from static electricity and electromagnetic signals, enhancing the quality of images captured by the image sensor module.
Implementation Method 1
a supporting plate with a metal layer, a rigid-flex board, and metal sheets to conduct static electricity
Implementation Method 2
metal sheets to conduct static electricity and shield electromagnetic signals
Data Source
AI summary
An image sensor module includes a rigid-flex board, an image sensor, a supporting plate, and a metal layer. The rigid-flex board defines a through hole penetrating its upper surface and its lower surface. An upper pad is positioned on an upper side surface of the rigid-flex board. The image sensor is positioned on the lower surface, and includes an image surface facing the through hole. A metal layer covers on a top surface and/or a bottom surface of the supporting plate, and a lower pad is positioned on a lower side surface of the supporting plate and connects to the metal layer. The supporting plate is positioned on the lower surface, and the image sensor is received between the rigid-flex board and the supporting plate. The metal sheet is electrically connected between the lower pad and the upper pad.