Image Sensor Signal Routing for Larger Pixel Arrays
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Solution Overview
Problem
The existing image sensor configurations are limited by the constrained number of signal paths in the pixel array, which restricts the active pixel resolution and the number of non-active pixels, such as noise compensation pixels, within a given die size, thereby limiting the capabilities of the image sensor.
Innovation Solution
The implementation of a pixel array with a larger footprint that overlaps peripheral pixels with inter-die interconnections, using vertical and horizontal signal path routing schemes to facilitate connections between pixels and circuitry blocks on separate dies, allowing for additional active and non-active pixels while maintaining efficient signal path routing.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Area of stationary object
If traditional straight signal path routing is used, then the signal path length is minimized, but the pixel array footprint is limited and cannot accommodate more pixels
Solution Approach 1:
The patent applies meandering signal path routing where control and readout paths curve through keep-out zones rather than following straight lines. This curvature allows paths to bypass restricted areas while still reaching additional pixels, effectively increasing the pixel array footprint without requiring longer straight signal paths.
Solution Approach 2:
The patent introduces a third dimension by utilizing keep-out zones as routing corridors. Instead of confining signal paths to the two-dimensional pixel grid, the design allows paths to extend into previously unused vertical or lateral spaces, enabling accommodation of more pixels within the same die area.
2Quantity of substance
If more pixels are included in the array, then pixel resolution and capabilities are enhanced, but the die size constraint is exceeded
Solution Approach 1:
The patent merges control path and readout path routing through the same keep-out zones. By having both control and readout signals traverse the same restricted corridors, the design efficiently utilizes available space without requiring separate dedicated paths for each signal type, thereby accommodating more pixels within the die size constraint.
Solution Approach 2:
The keep-out zones, traditionally serving as exclusion areas, are repurposed as multi-functional routing corridors that simultaneously accommodate both control and readout signal paths. This universal utilization of space allows the design to include more pixels without proportionally increasing the die area.
3Adaptability or versatility
If signal paths are routed through keep-out zones, then more pixels can be connected, but the routing complexity increases
Solution Approach 1:
The patent segments the pixel array into regions that can be independently routed through different keep-out zones. This segmentation allows flexible configuration where different pixel groups can utilize different routing paths, providing adaptability while managing overall routing complexity through modular organization.
Data Source
AI summary
An image sensor may include an image sensor pixel array. The image sensor pixel array may include active image sensor pixels and non-active image sensor pixels. A line of peripheral image sensor pixels may be coupled to a corresponding interconnect structure via a pixel signal path. The pixel signal path may include portions that overlap pass-through pixels and a keep-out region beyond an edge of the image sensor pixel array. Multiple interconnect structures may connect the image sensor pixel array implemented on a first integrated circuit die to pixel control and readout circuitry on a second integrated circuit die.