Solid-State Image Sensor Bonding Without Solder Balls
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
As solid-state image pickup devices are downsized, the area occupied by signal output terminals increases, making further downsizing difficult due to limitations in materials and device configurations.
Innovation Solution
The use of a connection configuration that does not rely on solder balls, employing conductive pads, metal bumps, conductive resins, or anisotropic conductive members to bond the solid-state image pickup element to the mounting substrate, allowing for reduced size and efficient heat dissipation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If solder balls are used for connection, then reliable electrical connection is achieved, but device size cannot be further reduced due to terminal portion area constraints
Solution Approach 1:
The patent extracts the solder ball connection method from the device architecture and replaces it with alternative connection methods (conductive adhesive, anisotropic conductive film, metal bump) that require less terminal area. This extraction allows the device to maintain reliable electrical connection while reducing the area occupied by terminal portions, thereby enabling further downsizing.
Solution Approach 2:
The patent changes the physical and material parameters of the connection portion by transitioning from spherical solder balls to flat conductive pads, adhesive-based connections, or crimped metal bumps. These parameter changes reduce the area requirement for terminal portions while maintaining or improving connection reliability, thus resolving the contradiction between connection reliability and device miniaturization.
2Adaptability or versatility
If conventional bonding methods are used, then material restrictions apply, but device configuration flexibility is limited
Solution Approach 1:
The patent introduces a universal connection structure that can accommodate multiple connection methods (conductive adhesive, anisotropic conductive film, metal bump, solder ball) within the same device architecture. This multi-functional connection design allows flexible material selection without requiring different device configurations, thereby enhancing adaptability while reducing configuration restrictions.
Solution Approach 2:
The patent segments the connection portion into distinct functional layers and components (bonding pad, connection material, mounting substrate interface) that can be independently selected and optimized. This segmentation allows different materials and connection methods to be applied to different segments, providing material selection flexibility without increasing overall device complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enables the reduction of material and device configuration restrictions, facilitating further miniaturization of solid-state image pickup devices while maintaining effective signal transmission and heat management.
Implementation Method 1
The conductive pad can dissipate heat generated from the solid-state image pickup element and the mounting substrate depending on a bonding area of the bonding surfaces.
Implementation Method 2
The conductive pad can be heated and melted in a state of being provided on one or both of a bonding surface of the solid-state image pickup element to be bonded with the mounting substrate and a bonding surface of the mounting substrate to be bonded with the solid-state image pickup element, and then cooled to bond the solid-state image pickup element and the mounting substrate together.
Data Source
AI summary
The present disclosure relates to a semiconductor device, a solid-state image pickup element, an image pickup device, and an electronic apparatus that are enabled to reduce restrictions on materials and restrictions on device configuration. A CSP imager and a mounting substrate are connected together with a connection portion other than a solder ball. With such a configuration, restrictions on materials and restrictions on device configuration are reduced, which has conventionally occurred because it is limited to a configuration in which solder balls are used for connection. The present disclosure can be applied to image pickup devices.