Image Sensor Spacer Design for Compact Module Assembly

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Solution Overview

Problem

The existing image sensor assemblies face limitations in reducing the interval between the filter and the image sensor, which restricts the overall height reduction, leading to potential defects and manufacturing challenges.

Innovation Solution

The electronic module design incorporates a spacer with a ring shape and an outer spacer, separated by a specific distance, along with a thermosetting adhesive solution, to space and bond the image sensor and cover, allowing precise spacing and reduced adhesion extension, thereby minimizing defects and size.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Length of stationary object

If the filter is coupled to the housing, then the filter is protected and positioned, but the interval between the filter and image sensor cannot be significantly reduced

Engineering Contradiction:
Improveinterval between filter and image sensorVSAvoidmanufacturing complexity
Core Design Contradiction:
Length of stationary objectVSEase of manufacture

Solution Approach 1:

The housing is divided into a first housing and a second housing that are coupled together. The filter is coupled to the second housing, which is positioned closer to the image sensor. This segmentation allows the filter housing to be optimized for compactness while the first housing provides structural support, enabling reduced interval without compromising manufacturability.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The patent transitions from a single housing structure to a multi-housing stacked configuration. By utilizing the vertical dimension and stacking the first housing above the second housing, the design achieves compactness in the vertical direction (reduced interval between filter and image sensor) while maintaining structural integrity through the coupling between housings.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

2Length of stationary object

If the interval between filter and image sensor is reduced, then overall height is reduced, but manufacturing defects may increase

Engineering Contradiction:
Improveoverall heightVSAvoidalignment precision
Core Design Contradiction:
Length of stationary objectVSManufacturing precision

Solution Approach 1:

A support structure is introduced as an intermediary element between the filter housing and the image sensor. This support structure provides precise positioning and alignment features that ensure accurate placement of the filter relative to the image sensor, enabling reduced overall height while maintaining manufacturing precision and reducing alignment defects.

Inventive Principle:
Principle #24Intermediary (Mediator)

3Strength

If the adhesive portion width is increased, then adhesion strength is improved, but adhesion extension to unwanted areas increases

Engineering Contradiction:
Improveadhesion strengthVSAvoidadhesion extension defects
Core Design Contradiction:
StrengthVSObject-generated harmful factors

Solution Approach 1:

The adhesive portion is designed with non-uniform width, being wider at the base and narrower toward the tip. This local quality variation provides strong adhesion at the base where maximum bonding strength is needed, while the narrower tip portion prevents excessive adhesion extension to unwanted areas, reducing manufacturing defects.

Inventive Principle:
Principle #3Local quality

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This configuration effectively reduces the distance between the image sensor and cover, minimizing defects and enabling a smaller image sensor assembly size while maintaining effective adhesion and protection.

Implementation Method 1

The adhesive portion may include a thermosetting adhesive solution

Methodology Applied
Scientific EffectThermosetting adhesive bonding: Chemical Bonding

Data Source

PatentUS10600835B2Electronic module and method of manufacturing the same
Publication Date: 2020.03.24 SAMSUNG ELECTRO MECHANICS CO LTD
  • US10600835B2 patent drawing
  • US10600835B2 patent drawing
  • US10600835B2 patent drawing

AI summary

An electronic module includes a first component, a second component, a spacer, and an adhesive portion. The first component includes a first surface. The second component is disposed to be spaced apart from the first surface by a distance of about 40 μm to about 200 μm. The spacer spaces the first component and the second component apart from each other. The adhesive portion is disposed between the first surface and a bonding surface of the spacer facing the first surface. The spacer includes an inner spacer having a ring shape, and an outer spacer surrounding the inner spacer and disposed spaced apart from the inner spacer by 50% or less of an overall width of the inner spacer and the outer spacer, and an overall width of the adhesive portion is 100% to 150% of the overall width of the inner spacer and the outer spacer.