Image Sensor Stacked Architecture Integration Density
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Solution Overview
Problem
Current image sensors face challenges in achieving high integration density, which limits their performance in converting optical images into electrical signals effectively.
Innovation Solution
The image sensor design includes a substrate with a photoelectric conversion layer, color filters, and a specific electrode structure that allows for improved integration density by sharing transistors and using a layered structure with through-electrodes and insulating layers to connect electrodes, enhancing the conversion of light signals into electrical signals.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Quantity of substance
If conventional image sensor structures are used, then manufacturing is simpler, but integration density is low
Solution Approach 1:
The patent implements a stacked three-dimensional architecture where photodiodes, color filters, and microlenses are arranged in vertical layers rather than planar configurations. Through-electrodes penetrate multiple layers to establish electrical connections, enabling high integration density by utilizing the vertical dimension for component placement and interconnection.
Solution Approach 2:
The patent embeds color filters within insulating structures and positions microlenses above specific pixel regions, creating a nested configuration where multiple functional elements are integrated within overlapping spatial volumes. This nesting approach maximizes the use of available space and increases the number of functional components per unit area.
2Adaptability or versatility
If more components are integrated, then functionality increases, but manufacturing precision requirements increase
Solution Approach 1:
The patent forms through-electrodes and insulating structures in predetermined positions before finalizing the positions of photodiodes, color filters, and microlenses. This preliminary structuring establishes a rigid framework that guides subsequent component placement, ensuring precise alignment and reducing manufacturing complexity despite the high number of integrated components.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design improves the integration density of the image sensor, allowing for efficient conversion of multiple light wavelengths into distinct electrical signals, thereby enhancing the sensor's performance and capability to generate multiple photoelectric signals from different light sources.
Implementation Method 1
The photodiode may be configured to convert incident light into an electrical signal
Data Source
AI summary
An image sensor includes a substrate having a first surface and a second surface opposite to each other, a first floating diffusion region provided in the substrate and being adjacent to the first surface, a through-electrode provided in the substrate and electrically connected to the first floating diffusion region, an insulating structure, a bottom electrode, a photoelectric conversion layer, and a top electrode sequentially stacked on the second surface, a color filter buried in the insulating structure, and a top contact plug penetrating the insulating structure to connect the bottom electrode to the through-electrode.