Movable Image Sensor Assembly With Grooved Stiffener Cooling
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Camera devices face challenges in securing electromagnetic force to move lenses due to increased weight with higher pixel counts, and heat dissipation and soldering defects occur when image stabilization is achieved by moving the image sensor.
Innovation Solution
A camera device design that drives the image sensor in three axes (x-axis shift, y-axis shift, and z-axis rolling) with a stiffener structure for enhanced heat dissipation and minimizes electrical connection defects by using a conductive layer with an open region and a conductive tape or epoxy for heat transfer.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If the lens diameter is increased to achieve higher pixel counts, then image quality is improved, but the weight of the lens increases making it difficult to secure electromagnetic force for movement
Solution Approach 1:
Instead of moving the lens to achieve image stabilization, the patent inverts the approach by moving the image sensor in the opposite direction. This allows high-quality imaging with large, heavy lenses to remain stationary while still achieving OIS functionality by displacing the sensor position relative to the lens.
Solution Approach 2:
The patent introduces a movable image sensor platform as an intermediary between the stationary lens and the processing system. This mediator (the sensor assembly) carries the heavy lens while allowing controlled displacement, separating the weight burden from the movement requirement.
2Measurement precision
If the image sensor is moved to perform image stabilization, then image quality is maintained with smaller lenses, but heat dissipation becomes problematic
Solution Approach 1:
The patent segments the camera system into distinct functional modules: a stationary lens assembly and a movable image sensor assembly. This segmentation allows the heat-generating sensor to be isolated and equipped with dedicated thermal management structures (heat dissipation fins) separate from the lens system.
Solution Approach 2:
The patent introduces heat dissipation fins as an intermediary thermal management structure between the image sensor and the environment. These fins act as a heat transfer medium, increasing surface area for efficient heat dissipation from the sensor without interfering with the optical path or image quality.
3Reliability
If the number of terminals for electrical conduction with the image sensor is increased, then electrical connection reliability is improved, but soldering defects increase as the gap between terminals narrows
Solution Approach 1:
The patent replaces the traditional mechanical soldering process with a conductive adhesive bonding system. Instead of using heat and pressure to melt solder between closely-spaced terminals, a conductive adhesive is applied that can bridge larger gaps between terminals, eliminating the need for precise soldering and reducing manufacturing defects.
Solution Approach 2:
The patent changes the bonding mechanism from thermal-mechanical (soldering) to chemical-adhesive (conductive adhesive). This parameter change allows for larger terminal spacing while maintaining electrical connectivity, thereby reducing soldering defects while preserving electrical connection reliability for multiple sensor terminals.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution enables effective image stabilization, improved heat dissipation, and reduced manufacturing costs by simplifying soldering processes due to enhanced electrical connections.
Implementation Method 1
a first stiffener being disposed at the second substrate... a plurality of grooves which are formed at the second surface and spaced apart from each other
Implementation Method 2
a drive unit which moves the image sensor with respect to the first substrate... drives an image sensor in three axes
Data Source
AI summary
A first embodiment of the present invention relates to a camera device comprising: a first substrate; a second substrate which is disposed on the first substrate; a first stiffener which is disposed at the second substrate; an image sensor which is disposed at the first stiffener; a connection substrate which connects the first substrate and the second substrate to each other; and a drive unit which moves the image sensor with respect to the first substrate, wherein the first stiffener comprises: a first surface at which the image sensor is disposed; a second surface which is opposite to the first surface; and a plurality of grooves which are formed at the second surface and spaced apart from each other.