Solid-State Image Sensor Support Structure for Thin Large Light Receivers
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Solution Overview
Problem
Existing solid-state imaging devices face challenges in reducing the thickness and increasing the area of the light receiving portion without causing bending.
Innovation Solution
A solid-state imaging device with a support, light receiving sensor, connection portions, and a resin layer, where the light receiving sensor is thinner than the frame portion, and supported by metal support portions with higher thermal conductivity, connected via metal connection portions with lower melting points, and a resin layer to maintain structural integrity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Area of moving object
If the area of the light receiving portion is increased while maintaining the thickness, then the light receiving area is improved, but the light receiving portion may bend
Solution Approach 1:
The support structure is segmented into multiple support portions distributed across the substrate, with each support portion locally supporting the light receiving portion. This segmentation allows the large-area light receiving portion to be divided into multiple smaller supported regions, preventing bending while maintaining the overall large light receiving area.
Solution Approach 2:
The support portions are strategically positioned at specific locations beneath the light receiving portion, providing localized support where needed. This local quality approach ensures that the light receiving portion maintains its thin profile in most areas while having reinforced support at critical points to prevent bending.
2Length of moving object
If the thickness of the light receiving portion is reduced, then the light receiving performance is improved, but the structural stability deteriorates
Solution Approach 1:
The support structure is divided into multiple discrete support portions rather than a continuous support layer. This segmentation allows the light receiving portion to be extremely thin while still receiving distributed support at multiple locations, preventing bending and maintaining structural stability despite the reduced thickness.
Solution Approach 2:
The support portions act as intermediary elements between the substrate and the light receiving portion. These intermediaries provide the necessary mechanical support to the thin light receiving portion, allowing it to maintain its reduced thickness while preventing bending through the mediating support structure.
3Loss of energy
If metal support portions with high thermal conductivity are used, then thermal dissipation is improved, but the manufacturing complexity increases
Solution Approach 1:
Instead of making the entire support structure of high thermal conductivity material, only specific support portions are formed with metal having high thermal conductivity. This local quality approach improves thermal dissipation at the critical locations where heat generation occurs, while keeping the overall manufacturing process simpler than creating a fully metal support structure.
Solution Approach 2:
The thermal conductivity parameter is changed locally at the support portions by selecting metal materials with higher thermal conductivity than the surrounding resin layer. This parameter change enables efficient thermal dissipation from the light receiving portion through the metal support portions without requiring the entire device to be made of high-conductivity materials, thus managing manufacturing complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively suppresses bending of the thinner light receiving portion, enhances thermal dissipation, and ensures reliable electrical connections while maintaining the device's structural integrity.
Implementation Method 1
a support portion disposed between the support and the light receiving portion, and supporting the light receiving portion
Implementation Method 2
the resin layer is disposed between the support and the light receiving portion
Implementation Method 3
a plurality of connection portions disposed between the support and the frame portion, and electrically connecting the plurality of first terminals and the plurality of second terminals
Implementation Method 4
a thermal conductivity of the support portion is higher than a thermal conductivity of the resin layer
Data Source
Figure 1
Figure 2
Figure 3(a)~3(b)
AI summary
A solid-state imaging device includes a support provided with a plurality of first terminals, a light receiving sensor including a frame portion provided with a plurality of second terminals and a light receiving portion formed to be thinner than the frame portion inside the frame portion, the light receiving sensor being disposed on the support such that the plurality of first terminals and the plurality of second terminals correspond to each other, a plurality of connection portions disposed between the support and the frame portion, and electrically connecting the plurality of first terminals and the plurality of second terminals, a support portion disposed between the support and the light receiving portion, and supporting the light receiving portion, and a resin layer disposed at least between the support and the light receiving portion.