Solid-State Image Sensor Symmetrical Connection Voltage Uniformity
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Solution Overview
Problem
In solid-state image sensors with a photoelectric conversion layer stacking configuration, achieving uniform voltage application to pixels is challenging, leading to uneven signal charge generation and deteriorated image quality due to non-uniform voltage distribution.
Innovation Solution
A solid-state image sensor design with a symmetrical arrangement of connection portions in the circumference region, allowing for uniform voltage application to the photoelectric conversion layers through a wiring portion and upper electrode, ensuring equal distances and preventing image quality deterioration.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If connection portions are disposed in the sensor region to apply voltage to the photoelectric conversion layer, then voltage application is achieved, but the upper side of the semiconductor substrate cannot be uniformly coated with the photoelectric conversion layer and manufacturing complexity increases
Solution Approach 1:
The connection portions are segmented and disposed in the circumference region rather than the sensor region, allowing the photoelectric conversion layer to be uniformly coated across the entire upper surface without obstruction from connection structures
Solution Approach 2:
The connection portions are extracted from the sensor region and relocated to the circumference region, separating the voltage application function from the photoelectric conversion area to enable uniform coating and simplify manufacturing
2Ease of manufacture
If connection portions are disposed far from the sensor region to simplify manufacturing, then manufacturing is simplified, but non-uniform voltage application occurs leading to image quality deterioration
Solution Approach 1:
The circumference region is specifically utilized as it provides optimal local conditions - sufficiently distant from the sensor region to enable uniform photoelectric conversion layer coating, yet close enough to ensure uniform voltage application across all pixels through the upper electrode
3Reliability
If multiple connection portions are used to apply voltage uniformly, then voltage uniformity is improved, but the distances from each connection portion to sensor region differ causing non-uniform voltage application
Solution Approach 1:
While multiple connection portions are used, their arrangement in the circumference region creates a symmetric pattern relative to the sensor region, ensuring equal distances from each connection portion to the sensor region, thereby achieving uniform voltage application without complex asymmetric arrangements
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design ensures uniform voltage application across all pixels, enhancing image quality by maintaining consistent signal charge generation and reducing manufacturing complexity and costs.
Implementation Method 1
a photoelectric conversion layer including an organic material or the like that generates an electric charge in accordance with incident light
Implementation Method 2
a voltage to generate an electric field between the upper electrode and the lower electrode
Data Source
AI summary
According to an aspect of the invention, a solid-state image sensor having a plurality of pixels includes a plurality of lower electrode, a photoelectric conversion layer, an upper electrode, a wiring portion and a plurality of connection portions. The plurality of lower electrodes respectively corresponds to the plurality of pixels. The photoelectric conversion layer is stacked on the lower electrodes. The upper electrode is stacked on the photoelectric conversion layer. The wiring portion supplies, to the upper electrode, a voltage to generate an electric field between the upper electrode and the lower electrode. The plurality of connection portions connects the wiring portion and the upper electrode. The plurality of connection portions are disposed in a circumference region which is a region other than a sensor region in which a plurality of photoelectric conversion elements are arranged. The plurality of connection portions is disposed in a symmetrical arrangement.