Image Sensor Test Module With Dummy Region
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Solution Overview
Problem
Existing test methods for image sensors, such as using a plastic leadless chip carrier (PLCC) or a printed circuit board (PCB), often fail to accurately reflect the electrical and optical environments of electronic devices, leading to reduced test accuracy and high costs due to the need for multiple test sockets for different image sensors.
Innovation Solution
A test module with a constant area and shape, including a test board with a dummy region and a cut-off region, is used to couple with image sensors. This module includes a connector to transmit electrical signals to a test socket, allowing for accurate testing of image sensors while reducing manufacturing costs by enabling testing of multiple image sensors with a single test socket.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If a PLCC is used to test image sensor performance, then the testing process is simple, but test accuracy is reduced because the electrical and optical environment of the electronic device is not reflected
Solution Approach 1:
The patent introduces a test board as an intermediary component between the image sensor and the test socket. This test board includes a PCB region with passive elements that replicates the electrical environment of the electronic device, and a dummy region with a cut-off region that provides the necessary structural framework without electrically interfering with the sensor testing. This intermediary structure enables accurate testing while maintaining ease of manufacture.
2Measurement precision
If a PCB containing the image sensor and passive elements is used to reflect the electrical environment, then test accuracy is improved, but manufacturing a test socket becomes costly and time-consuming
Solution Approach 1:
The patent divides the test board into two distinct regions: a PCB region containing the image sensor and passive elements for electrical environment reflection, and a dummy region with a cut-off region that provides structural support. This segmentation allows the PCB region to be optimized for testing accuracy while the dummy region can be standardized for efficient manufacturing and socket creation.
Solution Approach 2:
The test board design with its standardized dummy region and cut-off region structure serves multiple functions: it provides the electrical environment for testing, maintains a constant area and shape for consistent socket fitting, and enables universal use across different image sensor types. This universality reduces the need for multiple specialized test sockets.
3Measurement precision
If different test sockets are manufactured for different image sensors, then each image sensor can be tested accurately, but the time and cost to test multiple image sensors increases
Solution Approach 1:
The patent creates a universal test socket design that can accommodate different image sensors through the standardized dummy region and cut-off region structure. The test board maintains a constant area and shape regardless of the specific image sensor being tested, allowing a single test socket design to work with multiple image sensor types while maintaining testing accuracy.
Data Source
AI summary
Provided is a test module for testing the performance of an image sensor, the test module including a test board having an area greater than an area of the image sensor and configured to be coupled to the image sensor, and a connector electrically connected to the image sensor and configured to transmit an electrical signal received from the image sensor to a test socket, wherein the test board includes a dummy region of which an outer perimeter corresponds to a perimeter of the test board and configured to be electrically cut off from the image sensor, and a cut-off region formed corresponding to an inner perimeter of the dummy region, located between the dummy region and the image sensor, and configured to electrically cut off the dummy region from the image sensor.