Image Sensor Package Thermal Management via Embedded Groove

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Solution Overview

Problem

Camera modules generate heat in image sensors due to repeated imaging, which can lead to thermal management issues, including condensation and potential electrical problems like short circuits.

Innovation Solution

An image sensor package design featuring a substrate with a receiving groove for a heat dissipation element, including a heat absorption and emission portion, where a bonding member seals the heat absorption portion from air, and a thermally conductive material is used to enhance heat dissipation.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Productivity

If the image sensor is operated for repeated imaging, then imaging functionality is maintained, but heat is generated in the image sensor

Engineering Contradiction:

Improveimaging functionalityVSAvoidheat in image sensor

Core Design Contradiction:

ProductivityVSTemperature

Solution Approach 1:

The heat dissipation element is extracted from the conventional location and embedded into a receiving groove formed in the substrate directly beneath the image sensor. This extraction allows the heat dissipation element to be positioned closer to the heat source while maintaining functional separation between imaging and thermal management systems.

Inventive Principle:

Principle #2Taking out (Extraction)

Solution Approach 2:

A bonding member is introduced as an intermediary substance to fill the space between the image sensor and the heat dissipation element. This bonding member serves dual functions: mechanically bonding the components together and thermally conducting heat from the image sensor to the heat dissipation element, thereby resolving the contradiction between maintaining imaging functionality and managing heat.

Inventive Principle:

Principle #24Intermediary (Mediator)

2Temperature

If the heat absorption portion is exposed to air, then heat dissipation occurs, but condensation forms on the heat absorption portion

Engineering Contradiction:

Improveheat dissipationVSAvoidcondensation

Core Design Contradiction:

TemperatureVSObject-affected harmful factors

Solution Approach 1:

The bonding member, which is necessary for mechanical bonding and thermal conduction, is utilized to simultaneously seal the heat absorption portion from air contact. This converts the bonding member from a simple structural element into a dual-function component that prevents condensation while maintaining heat dissipation through thermal conduction, thereby converting a potential harm (condensation) into a manageable condition.

Inventive Principle:

Principle #22Blessing in disguise (Convert harm into benefit)

3Temperature

If a receiving groove is formed in the substrate, then heat dissipation efficiency is improved, but substrate structure is modified

Engineering Contradiction:

Improveheat dissipation efficiencyVSAvoidsubstrate structure

Core Design Contradiction:

TemperatureVSDevice complexity

Solution Approach 1:

The receiving groove is merged with the substrate manufacturing process itself, forming an integrated structure where the groove is directly formed in the substrate material. This merging approach combines the substrate's structural function with the thermal management function, allowing the heat dissipation element to be embedded within the substrate without requiring separate housing or mounting structures, thereby improving heat dissipation while minimizing additional structural complexity.

Inventive Principle:

Principle #5Merging (Combining)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This configuration effectively reduces the distance for heat dissipation, increases cooling efficiency, and prevents condensation on the heat absorption portion, thereby minimizing electrical issues and improving the reliability of the image sensor package.

Implementation Method 1

a heat absorption portion configured to absorb heat dissipating from a contact surface

Methodology Applied

Scientific EffectThermal conduction: Conduction (thermal)

Implementation Method 2

a heat emission portion configured to emit heat absorbed by the heat absorption portion

Methodology Applied

Scientific EffectThermal radiation: Thermal Radiation

Implementation Method 3

The bonding member may be formed of a conductive material

Methodology Applied

Scientific EffectThermal conduction: Conduction (thermal)

Data Source

PatentUS20230207713A1Image sensor package

Publication Date: 2023.06.29 SAMSUNG ELECTRO MECHANICS CO LTD

AI summary

An image sensor package is provided. The image sensor package includes an image sensor, a substrate on which the image sensor is disposed on a first surface of the substrate and a receiving groove is disposed in a second surface of the surface, and a heat dissipation element including a heat absorption portion configured to absorb heat from a contact surface and a heat emission portion configured to emit heat absorbed by the heat absorption portion, and coupled to the second surface of the substrate, wherein, in the heat dissipation element, at least a portion of the heat absorption portion is accommodated in the receiving groove and coupled to the substrate.