Image Sensor Thermal Pads with Vias for Heat Dissipation
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Solution Overview
Problem
Modern CMOS image sensors lack sufficient area for effective thermal dissipation due to their grid array architecture, leading to reduced heat conduction compared to older CCD image sensors.
Innovation Solution
The implementation of thermal pads with thermal vias and a thermoelectric cooling element (TEC) for active cooling, which enhances heat transfer from the image sensor by coupling thermal pads directly to conductive pads on the image sensor and using a TEC to further dissipate heat.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If modern CMOS image sensors with grid array architecture are used, then integration density and pixel count are improved, but thermal dissipation area is reduced
Solution Approach 1:
The patent extends thermal management from the two-dimensional sensor surface into the third dimension by implementing multi-layer thermal vias that penetrate through the substrate thickness. This vertical thermal pathway compensates for the reduced horizontal dissipation area, allowing heat to be conducted away through the substrate背面 to heat sinks or cold fingers.
Solution Approach 2:
The thermal dissipation system is segmented into multiple independent thermal vias distributed across the substrate, each providing a separate heat conduction pathway. This segmentation allows heat from different pixel regions to be independently managed and conducted away through multiple parallel paths, effectively increasing the total thermal dissipation capacity despite limited surface area.
2Temperature
If thermal pads are added to improve heat dissipation, then thermal conduction is improved, but device complexity increases
Solution Approach 1:
The patent merges the thermal pad function directly into the substrate structure by integrating thermal vias that extend from the front surface through the substrate to the背面. This integration eliminates the need for separate, externally attached thermal pads, reducing assembly complexity while maintaining effective thermal conduction pathways.
Solution Approach 2:
The thermal vias act as intermediary structures that bridge the thermal connection between the pixel array and the substrate背面 heat dissipation elements. These vias provide a direct thermal pathway without requiring complex intermediate thermal management components, simplifying the overall device architecture.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution significantly improves heat dissipation, reducing dark current and maintaining the image sensor within an optimal operating temperature range, thus enhancing its performance and reliability.
Implementation Method 1
The at least one thermal pad is formed with a plurality of first thermal vias penetrating the thermal pad and the circuit board for transfer of heat of the image sensor
Implementation Method 2
an image sensor assembly with active cooling by a thermoelectric cooling element (TEC) for heat dissipation from the image sensor
Data Source
AI summary
An electronic component assembly having thermal pads with thermal vias coupling an image sensor and a camera board fab is provided for heat dissipation. The electronic component assembly can include: a circuit board having at least one thermal pad disposed on a top surface of the circuit board; and an image sensor disposed on the top surface of the circuit board, having at least one conductive pad disposed at at least one corner of the image sensor. The at least one thermal pad is coupled to the at least one conductive pad of the image sensor and the at least one thermal pad is formed with a plurality of first thermal vias penetrating the thermal pad and the circuit board for transfer of heat of the image sensor.