Thin Image Sensor Module Removing Spacer and Protecting Glass

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Solution Overview

Problem

Conventional image sensing devices are thickened by the presence of spacers and protecting glasses, which affect light transmission and image quality due to poor flatness and reduced light utility efficiency.

Innovation Solution

An image sensing device with a thin thickness is achieved by omitting the spacer and protecting glass, using an optical module with a barrel and transparent element directly on the image sensing chip, and a protecting element composed of molding compound or metal/plastic/ceramic material that covers the chip and barrel, adhered through an adhesive.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If a spacer and protecting glass are used to support and protect the lens module, then the structural integrity and protection are improved, but the device thickness increases and light transmission quality deteriorates

Engineering Contradiction:

Improveprotection of image sensing regionVSAvoiddevice thickness

Core Design Contradiction:

ReliabilityVSLength of stationary object

Solution Approach 1:

The patent removes the traditional spacer and protecting glass components from the optical path. Instead, the lens module is directly mounted on the image sensing chip surface, and a planarization layer is formed only where needed to ensure flatness. This extraction of unnecessary components reduces device thickness and eliminates the flatness issues that affect light transmission quality.

Inventive Principle:

Principle #2Taking out (Extraction)

Solution Approach 2:

The patent merges the lens module directly with the image sensing chip by mounting the lens module on the chip surface and forming a planarization layer that integrates with the chip structure. This merging eliminates the need for separate spacer and protecting glass components, thereby reducing overall device thickness while maintaining structural integrity and protection.

Inventive Principle:

Principle #5Merging (Combining)

2Strength

If a spacer and protecting glass are used to support the lens module, then structural support is improved, but the flatness deteriorates affecting light transmission path

Engineering Contradiction:

Improvesupport capabilityVSAvoidflatness of optical path

Core Design Contradiction:

StrengthVSManufacturing precision

Solution Approach 1:

The patent removes the spacer and protecting glass that cause flatness deterioration. The lens module is directly mounted on the image sensing chip, and a planarization layer is formed only in the region where the lens module is mounted to ensure the light transmission path remains flat and precise.

Inventive Principle:

Principle #2Taking out (Extraction)

Solution Approach 2:

The planarization layer is formed locally only in the region where the lens module is mounted on the image sensing chip. This localized approach ensures flatness and precision in the critical optical path area without requiring a spacer that would affect overall device flatness.

Inventive Principle:

Principle #3Local quality

3Reliability

If a protecting glass is used to protect the image sensing region, then protection is improved, but light utility efficiency deteriorates due to reduced transparency

Engineering Contradiction:

Improveprotection from particlesVSAvoidlight utility efficiency

Core Design Contradiction:

ReliabilityVSLoss of energy

Solution Approach 1:

The patent removes the protecting glass component that causes light loss. Instead, the lens module is directly mounted on the image sensing chip surface, and a planarization layer is formed to protect the sensing region. This extraction eliminates the transparency issues and light absorption problems associated with protecting glass, thereby improving light utility efficiency while maintaining protection.

Inventive Principle:

Principle #2Taking out (Extraction)

4Reliability

If conventional spacer and protecting glass structure is used, then support and protection are achieved, but device complexity increases

Engineering Contradiction:

Improvestructural support and protectionVSAvoidnumber of components

Core Design Contradiction:

ReliabilityVSDevice complexity

Solution Approach 1:

The patent merges the lens module directly with the image sensing chip by mounting the lens module on the chip surface. The planarization layer is formed as an integrated part of this structure, eliminating the need for separate spacer and protecting glass components. This merging reduces device complexity while maintaining structural support and protection functionality.

Inventive Principle:

Principle #5Merging (Combining)

Solution Approach 2:

The planarization layer serves multiple functions: it provides structural support, ensures flatness for the optical path, and protects the image sensing region. This multi-functional component replaces the traditional spacer and protecting glass, reducing the number of components and simplifying the overall device structure.

Inventive Principle:

Principle #6Universality (Multi-functionality)

Data Source

PatentUS8982268B2Image sensing device

Publication Date: 2015.03.17 XENOGENIC DEVELOPMENT LIMITED LIABILITY COMPANY

AI summary

An image sensing device includes an image sensing chip, an optical module and a protecting element. The image sensing chip has a front surface defining an image sensing region thereon. The optical module includes a barrel and at least one transparent element. The barrel is directly disposed on the front surface and around the image sensing region. The transparent element is disposed in the barrel and faces to the image sensing region. The protecting element covers an area of the front surface outside the optical module and surrounds the barrel. The image sensing device has a thin thickness.