Image Sensor Package Structure With Thin Substrate Support
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Solution Overview
Problem
Current semiconductor packages with image sensors face challenges in achieving small size, high density, low power consumption, multifunctionality, high signal-processing speed, reliability, and cost-effectiveness, while also requiring improved fabrication processes to increase production yield.
Innovation Solution
A semiconductor package design featuring a semiconductor chip structure with an image sensor chip and a logic chip in contact, a transparent substrate, a dam between the chip and substrate, and an adhesive layer, which includes a micro lens array and light-shielding patterns, and a simplified fabrication method involving a wafer support system process to reduce thickness and enhance integration density.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If the substrate thickness is reduced to achieve smaller package size, then the package size decreases, but the substrate strength and reliability deteriorate
Solution Approach 1:
The patent employs a composite structure combining a thin transparent substrate with a support layer formed from adhesive material. This composite approach allows the substrate to maintain optical transparency while the support layer provides mechanical strength, resolving the contradiction between reduced thickness for smaller size and sufficient strength for reliability.
Solution Approach 2:
The adhesive layer serves as an intermediary element between the thin substrate and the semiconductor chips. It provides mechanical support to the otherwise fragile thin substrate while also serving its bonding function, thus enabling the substrate to be made thinner without compromising overall structural strength.
2Quantity of substance
If multiple chips are integrated to achieve high density and multifunctionality, then the integration density increases, but the device complexity increases
Solution Approach 1:
The patent merges multiple semiconductor chips (image sensor chip, logic chip, and memory chip) onto a single transparent substrate, creating a highly integrated multifunctional device. The support layer and adhesive structure provide a unified framework that holds these diverse components together, achieving high integration density while managing complexity through a common structural platform.
Solution Approach 2:
The transparent substrate serves multiple functions simultaneously: it acts as a mechanical support structure, an optical window for light transmission to the image sensor, and a mounting platform for multiple different types of chips. This multi-functionality reduces the need for separate structural components, thereby managing device complexity while achieving high integration.
3Volume of moving object
If the substrate is made thinner to reduce package size, then the package size decreases, but the fabrication precision and alignment difficulty increase
Solution Approach 1:
The support layer is formed on the substrate before the semiconductor chips are mounted. This preliminary structural preparation provides mechanical reinforcement to the thin substrate, making it more robust during subsequent fabrication steps such as chip mounting and wire bonding, thereby improving manufacturing precision and reducing alignment difficulties.
4Strength
If a support layer is added to enhance substrate strength, then the substrate strength increases, but the package size and complexity increase
Solution Approach 1:
The support layer is implemented as a thin film of adhesive material rather than a thick rigid layer. This thin film provides sufficient mechanical support to the substrate while minimizing the increase in overall package size. The adhesive layer acts as a flexible support that reinforces the substrate without adding significant volume.
Data Source
AI summary
Disclosed are a semiconductor package and a method of fabricating the same. The semiconductor package may include a semiconductor chip structure, a transparent substrate disposed on the semiconductor chip structure, a dam placed on an edge of the semiconductor chip structure and between the semiconductor chip structure and the transparent substrate, and an adhesive layer interposed between the dam and the semiconductor chip structure. The semiconductor chip structure may include an image sensor chip and a logic chip, which are in contact with each other, and the image sensor chip may be closer to the transparent substrate than the logic chip.