Image Sensor Package with Through-Chip Conducting Channels

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Solution Overview

Problem

Conventional image sensor module package structures face challenges in reducing volume and improving production yield due to defects in transparent layers and the need for wiring, which affects image-sensing accuracy and sensitivity.

Innovation Solution

An image sensor module package structure with a supporting element that separates light-transmitting and light-sensing elements by a proper distance, using a chip with a conducting channel for electrical connection without substrate wiring, and a light-transmitting element combined with the supporting element using adhesives, allowing for improved accuracy and sensitivity.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Ease of manufacture

If a transparent layer is covered on the top surface of the base and then light-sensing elements are cut off the wafer, then the package structure can be formed, but defects or stains on the transparent layer jeopardize image-sensing sensitivity and production yield

Engineering Contradiction:

Improvepackage structure formationVSAvoidimage-sensing sensitivity

Core Design Contradiction:

Ease of manufactureVSReliability

Solution Approach 1:

The patent divides the package structure into separate components: the base with metallization traces is prepared first, then the transparent layer is attached separately. This segmentation allows the transparent layer to be handled and inspected independently before attachment, preventing defects from compromising the entire device while maintaining manufacturing efficiency.

Inventive Principle:

Principle #1Segmentation

2Illumination intensity

If light-pervious glass is implemented as the transparent layer, then transparency is achieved, but edges tend to be cracked or jagged in cutting process reducing production yield

Engineering Contradiction:

Improvelight transparencyVSAvoidproduction yield

Core Design Contradiction:

Illumination intensityVSProductivity

Solution Approach 1:

The patent extracts the cutting operation from the transparent layer processing sequence. By attaching the transparent layer to the base before final assembly and avoiding direct cutting of the glass edges, the method eliminates the source of cracks and jagged edges, maintaining both transparency and production yield.

Inventive Principle:

Principle #2Taking out (Extraction)

3Reliability

If a substrate with metallization traces and wiring procedure is used to electrically connect the image sensing chip, then electrical connection is achieved, but wiring space cannot be saved and the package structure cannot be further downsized

Engineering Contradiction:

Improveelectrical connectionVSAvoidpackage volume

Core Design Contradiction:

ReliabilityVSVolume of moving object

Solution Approach 1:

The patent merges the electrical connection function directly into the chip structure by incorporating conducting channels within the chip itself. This eliminates the need for separate substrate wiring layers and external wiring procedures, achieving both reliable electrical connection and compact package size.

Inventive Principle:

Principle #5Merging (Combining)

4Volume of moving object

If the light transparent layer is positioned close to the light-sensing elements to reduce distance, then package volume is reduced, but image-sensing accuracy and sensitivity deteriorate due to aberration

Engineering Contradiction:

Improvepackage volumeVSAvoidimage-sensing accuracy

Core Design Contradiction:

Volume of moving objectVSMeasurement precision

Solution Approach 1:

The patent introduces a supporting element as an intermediary structure between the light-transparent layer and the light-sensing elements. This mediator maintains an optimal separation distance that prevents image aberration while minimizing the overall package volume, resolving the conflict between compactness and imaging accuracy.

Inventive Principle:

Principle #24Intermediary (Mediator)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This design reduces the volume of the image sensor module package, enhances image-sensing accuracy and sensitivity, and improves production yield by eliminating defects in the transparent layer and eliminating the need for substrate wiring.

Implementation Method 1

a light-transmitting element (50) combined with the second coupling surface

Methodology Applied

Scientific EffectLight transmission: Light

Implementation Method 2

combined with the supporting element using adhesives

Methodology Applied

Scientific EffectAdhesion: Adhesive

Data Source

PatentUS7598580B1Image sensor module package structure with supporting element

Publication Date: 2009.10.06 KT IMAGING USA LLC

AI summary

An image sensor module package structure with a supporting element comprises a chip, the supporting element and a light-transmitting element. The chip has light-sensing elements arranged on a light-sensing area of a first surface thereof, first conducting pads electrically connected to the light-sensing elements, and a conducting channel passing through the chip and electrically connected to the first conducting pads at one end. The supporting element has an opening, a first coupling surface, and a second coupling surface. The opening corresponds to the light-sensing area and the first coupling surface is combined with the first surface of the chip while the light-transmitting element is combined with the second coupling surface. The supporting element separates the light-transmitting element from the chip by a proper distance, so as to enhance an image sensing accuracy of an image sensor module. The chip having the conducting channel effectively facilitates reducing an overall volume of the image sensor module package structure.