Packaged Image Sensor Through-Hole Layout for Flexible Endoscopes

Resolve Bottlenecks,
Find Innovative Solutions
Generate Solutions

Solution Overview

Problem

Conventional endoscope image sensing modules face difficulties in demolding due to large aspect ratios of the mold and have a larger bending radius due to the placement of steering control wires, making them inconvenient to operate and fabricate.

Innovation Solution

The packaged image sensor features a substrate with a through-hole to secure the relative position of the pipe and image sensor, allowing easy demolding and reducing the bending radius by integrating flexible materials for the pipe and encapsulant, and connecting steering control wires directly to the substrate or circuit board.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Stability of the object's composition

If the pipe tightly sleeves the protrudent element and the mold has a larger aspect ratio, then the relative position of the pipe and image sensing element is fixed, but demolding becomes difficult

Engineering Contradiction:
Improverelative position stabilityVSAvoiddemolding difficulty
Core Design Contradiction:
Stability of the object's compositionVSEase of manufacture

Solution Approach 1:

The invention divides the mold into a fixed mold and a movable mold that can separate from each other. The movable mold can be pulled out along the pulling direction after injection, allowing easy demolding while maintaining the tight fit between pipe and protrudent element during the injection process.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The mold structure transitions from a static single-piece design to a dynamic multi-piece design where the movable mold can change position. The movable mold moves from an initial position during injection to a separated position for demolding, enabling both tight positioning and easy removal.

Inventive Principle:
Principle #15Dynamics

2Adaptability or versatility

If steering control wires are connected to the proximal end of the image sensing module, then the module can be steered, but the bending radius becomes larger which inconveniences operation

Engineering Contradiction:
Improvesteering capabilityVSAvoidbending radius
Core Design Contradiction:
Adaptability or versatilityVSEase of operation

Solution Approach 1:

The steering control wires are routed through the working channel pipe rather than along the external surface of the module. This internal routing through a different spatial dimension (inside the pipe vs. outside) allows for a smaller external bending radius while maintaining steering functionality.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

3Volume of moving object

If the image sensing module is miniaturized, then it can access narrower cavities, but the distance between steering control wires and top end increases making operation difficult

Engineering Contradiction:
Improvemodule sizeVSAvoidsteering control distance
Core Design Contradiction:
Volume of moving objectVSEase of operation

Solution Approach 1:

By routing the steering control wires internally through the working channel pipe, the invention eliminates the need for long external wire runs. This internal routing approach allows miniaturization while keeping the steering control distance short and manageable.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

Data Source

PatentUS12004720B2Packaged image sensor and endoscope
Publication Date: 2024.06.11 MEDIMAGING INTEGRATED SOLUTION INC
  • US12004720B2 patent drawing
  • US12004720B2 patent drawing
  • US12004720B2 patent drawing

AI summary

A packaged image sensor includes a substrate, an image sensor, a light-emitting element, and a first encapsulant. The substrate includes a through-hole. The image sensor and the light-emitting element are disposed on the substrate and are electrically connected to the substrate. The first encapsulant is filled between the image sensor and the light emitting element, and keeps the through-hole of the substrate opened. The through-hole of the substrate of the above-mentioned packaged image sensor can define a relative position between a pipe and the image sensor to facilitate the subsequent packaging process. An endoscope including the above-mentioned packaged image sensor is also disclosed.