Stacked Image Sensor Through-Via Layout for Smaller Packages
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Solution Overview
Problem
As image pickup devices are further downsized, the area occupied by signal terminal portions increases, making further downsizing difficult due to the need for efficient signal input and output mechanisms.
Innovation Solution
The implementation of a layered structural body configuration with a pixel array unit, input circuit unit, output circuit unit, and signal processing circuit, utilizing through-vias to connect external terminals to the semiconductor substrate, allowing for compact integration of signal input and output functions.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If a plurality of semiconductor substrates is layered to downsize the image pickup device, then the device size is reduced, but the area occupied by the terminal portion that takes out the output signal increases with respect to the plane size of the device
Solution Approach 1:
The patent applies dimensionality change by moving the terminal portion from the planar surface to the side surface of the device. Through-holes penetrate the semiconductor substrate vertically, allowing terminal portions to be arranged on the side surface rather than occupying plane area on the sensor surface. This resolves the contradiction by reducing terminal portion area ratio while maintaining compact device volume through the layered substrate structure.
Solution Approach 2:
The patent segments the device into multiple functional layers: a first semiconductor substrate containing the pixel array, a second semiconductor substrate containing circuit units, and intermediate layers with through-holes. This segmentation allows the terminal portions to be separated from the pixel array plane and positioned on the side surface, reducing the terminal portion area ratio while maintaining efficient signal output.
2Volume of moving object
If the terminal portion area is reduced to enable further downsizing, then the device size is reduced, but the signal input and output mechanisms become less efficient
Solution Approach 1:
The patent resolves this contradiction by transitioning signal input/output from a planar arrangement to a three-dimensional arrangement using vertical through-holes. Multiple terminal portions can be densely packed on the side surface without compromising signal efficiency, as each through-hole provides a direct vertical connection path from the pixel array through the substrate to the external terminal.
Solution Approach 2:
The patent introduces intermediate conductive structures (through-holes filled with conductive material) that mediate the signal transmission between the pixel array in the first substrate and the terminal portions on the side surface. This intermediary structure maintains efficient signal coupling while enabling compact terminal arrangement that reduces overall device size.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration enables further downsizing of the device while maintaining effective signal processing and output, reducing the external size of the image pickup device.
Implementation Method 1
a pixel array unit, in which a pixel having a photodiode that performs photoelectric conversion on incident light is two-dimensionally arrayed
Data Source
AI summary
The present disclosure relates to an image pickup device and an electronic apparatus that enable further downsizing of device size. The device includes: a first structural body and a second structural body that are layered, the first structural body including a pixel array unit, the second structural body including an input/output circuit unit, and a signal processing circuit; a first through-via, a signal output external terminal, a second through-via, and a signal input external terminal that are arranged below the pixel array, the first through-via penetrating through a semiconductor substrate constituting a part of the second structural body, the second through-via penetrating through the semiconductor substrate; a substrate connected to the signal output external terminal and the signal input external terminal; and a circuit board connected to a first surface of the substrate. The present disclosure can be applied to, for example, the image pickup device, and the like.