Image Sensor Package Trench Insulator Design

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Solution Overview

Problem

Conventional image sensor packages have large dimensions and are prone to damage during fabrication due to the conductive layer being formed close to the exterior, leading to device failure.

Innovation Solution

A chip package design featuring a substrate with a semiconductor device and conductive pad, an insulator ring surrounding an intermediate layer, and a conductive layer connected to the conductive pad, which reduces the thickness and vulnerability of the package by routing signals through a trench insulator and through via, rather than the substrate's sidewalls.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If the conductive layer is formed on the sidewalls of the substrate and carrying plate to electrically connect the bonding pad to the solder ball, then the electrical connection is achieved, but the package dimensions become large and the conductive layer becomes vulnerable to damage during fabrication

Engineering Contradiction:

Improveconductive layer damage resistanceVSAvoidpackage thickness

Core Design Contradiction:

ReliabilityVSLength of stationary object

Solution Approach 1:

The conductive path is routed vertically through the substrate thickness via a through-substrate via, rather than horizontally along the sidewalls. This dimensional change shortens the conductive path length and protects it from exterior damage during fabrication, while maintaining electrical connectivity between the bonding pad and solder ball

Inventive Principle:

Principle #17Another dimension (Dimensionality change)

Solution Approach 2:

The conductive layer is nested within the substrate structure through the through-substrate via, rather than being placed on the exterior sidewalls. This nesting protects the conductive layer from damage during fabrication while achieving the electrical connection function

Inventive Principle:

Principle #7Nested doll (Nesting)

2Ease of manufacture

If the conductive layer is formed close to the exterior area of the package, then the electrical connection is achieved, but the conductive layer is prone to damage during fabrication resulting in device failure

Engineering Contradiction:

Improvefabrication yieldVSAvoidconductive layer damage

Core Design Contradiction:

Ease of manufactureVSObject-affected harmful factors

Solution Approach 1:

The conductive layer is extracted from the vulnerable exterior sidewall position and repositioned to the interior of the substrate through the through-substrate via. This extraction removes the conductive layer from the harmful exterior environment, reducing fabrication damage and improving yield

Inventive Principle:

Principle #2Taking out (Extraction)

Solution Approach 2:

The substrate structure serves as a protective cushion around the conductive layer in the through-substrate via, shielding it from exterior damage during fabrication processes before the package is completed

Inventive Principle:

Principle #11Beforehand cushioning (Prior cushioning)

Data Source

PatentUS9190362B2Image sensor package with trench insulator and fabrication method thereof

Publication Date: 2015.11.17 XINTEC INC

AI summary

The invention provides a chip package and a fabrication method thereof. In one embodiment, the chip package includes: a substrate having a semiconductor device and a conductive pad thereon; an insulator ring filling a trench formed in the substrate, wherein the insulator ring surrounds an intermediate layer below the conductive pad; and a conductive layer disposed below a backside of the substrate and electrically connected to the conductive pad.