Image Sensor Module Turning Prism Cross-Section Reduction
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Solution Overview
Problem
Existing endoscope designs face challenges in minimizing the cross-sectional dimension of the distal head to accommodate image sensors and other components, limiting the types of image sensors that can be used due to space constraints.
Innovation Solution
An image sensor module configuration with a circuit board, image sensor, and turning prism, where the image sensor is oriented parallel to the axis of the distal head, and cable connections are managed to minimize cross-sectional area, allowing for flexible circuit board sections and integrated RF shielding to reduce overall dimensions.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If an image sensor is mounted with its image collecting surface parallel to the distal head end, then the image sensor can be easily integrated, but the cross-sectional dimension of the distal head becomes too large
Solution Approach 1:
The patent applies dimensionality change by reorienting the image sensor from a parallel mounting (which would require large cross-sectional area) to a perpendicular mounting relative to the distal head end. This dimensional reconfiguration allows the image sensor to be integrated within the limited cross-sectional space of the distal head while maintaining effective image capture functionality through the use of a turning prism to redirect the optical path.
2Area of stationary object
If the distal head cross-sectional dimension is reduced to accommodate space constraints, then more room is available for other components, but the image sensor cannot be properly oriented for image collection
Solution Approach 1:
The patent introduces a turning prism as an intermediary optical element that mediates between the space-constrained distal head geometry and the image sensor's optical requirements. The turning prism redirects the optical path from the objective lens to the image sensor, enabling the sensor to be mounted in a perpendicular orientation (saving cross-sectional space) while still receiving images properly for collection and processing.
3Ease of operation
If a traditional endoscope configuration with lenses and light conduits is used, then image viewing is achieved, but the distal head requires excessive space that limits miniaturization
Solution Approach 1:
The patent replaces the traditional mechanical optical system (multiple lenses and light conduits requiring extensive space) with a compact electronic imaging system. An image sensor (electronic detector) is positioned at the distal head to directly capture images, eliminating the need for complex lens assemblies and light transmission pathways through the shaft. This substitution dramatically reduces distal head volume while maintaining image viewing functionality through electronic transmission of captured images.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration reduces the cross-sectional dimension of the image sensor module, allowing for more space in the distal head for other components like illumination and working channels, while maintaining effective image capture and reducing interference from RF emissions.
Implementation Method 1
The turning prism has a front surface facing in a direction from the rearward end to the forward end of the circuit board and secured to a top plane of the image sensor
Data Source
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AI summary
An image sensor module (301) includes a circuit board (616), an image sensor (611), and a turning prism (608). The circuit board (616) has first and second side sections (703, 704) each extending in a respective plane transverse to a plane of a center section (702) to define a module interior volume (707). The image sensor (611) has a bottom plane (614) mounted on an inner face (615) of the circuit board (616) within the module interior volume (707). The turning prism (608) has a mounting surface secured to a top plane (610) of the image sensor (611). An electronic component (625) arrangement is operatively mounted on the inner face (615) of the circuit board (616) between the image sensor (611) and a circuit board rearward end (705). A number of wires (628) providing power and data connections to the circuit board (616) are operatively connected to contacts (627) located on the circuit board (616) in the interior volume (707) between the electronic component (625) arrangement and the circuit board rearward end (705).