Image Sensor Module Wire Sealing Unit Thermal Bridge

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Solution Overview

Problem

Camera modules with image sensors installed on substrates face rapid temperature rises, leading to premature shutdown, as the temperature increase curve is exponential, and a 2°C decrease in temperature delays the shutdown by only 3 to 4 minutes.

Innovation Solution

A module design featuring an organic substrate with an image sensor, a wire connecting the sensor and substrate, and a wire sealing unit with higher thermal conductivity than the substrate, where the wire sealing unit is adhered to the side surface of the image sensor to enhance heat dissipation.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Productivity

If the module operates continuously, then productivity is improved, but temperature rises exponentially causing shutdown

Engineering Contradiction:

Improveoperational timeVSAvoidmodule temperature

Core Design Contradiction:

ProductivityVSTemperature

Solution Approach 1:

A heat dissipation member is introduced as an intermediary component between the image sensor and the substrate. This heat dissipation member has higher thermal conductivity than the substrate material, serving as a thermal bridge to conduct heat away from the image sensor more effectively, thereby suppressing temperature rise and extending operational time before shutdown

Inventive Principle:

Principle #24Intermediary (Mediator)

2Ease of manufacture

If a substrate with standard thermal conductivity is used, then ease of manufacture is improved, but heat dissipation is insufficient

Engineering Contradiction:

Improvesubstrate fabricationVSAvoidheat dissipation efficiency

Core Design Contradiction:

Ease of manufactureVSLoss of energy

Solution Approach 1:

The substrate structure is designed as a composite system combining two different materials: a standard substrate material for ease of manufacture and a heat dissipation member with superior thermal conductivity properties. This composite approach allows the module to benefit from both the manufacturability of standard materials and the heat dissipation performance of specialized materials

Inventive Principle:

Principle #40Composite materials

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This design effectively suppresses heat rise in the module, prolonging the time before reaching a critical temperature, thereby extending the module's operational time by improving heat dissipation efficiency.

Implementation Method 1

a wire sealing unit adhered to a side surface of the image sensor while encompassing the wire... A thermal conductivity of the wire sealing unit is higher than a thermal conductivity of the organic substrate

Methodology Applied

Scientific EffectThermal conduction: Conduction (thermal)

Data Source

PatentUS11417693B2Module, method for manufacturing module, and electronic device

Publication Date: 2022.08.16 SONY GROUP CORP

AI summary

Provided is a module including an organic substrate, an image sensor mounted on an upper surface of the organic substrate, a wire connecting the image sensor and the organic substrate, and a wire sealing unit adhered to a side surface of the image sensor while encompassing the wire. A thermal conductivity of the wire sealing unit is higher than a thermal conductivity of the organic substrate.