Solid State Image Sensor Wiring Board EMC Noise Reduction
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Solution Overview
Problem
Existing solid state image sensing devices face challenges in reducing electromagnetic compatibility (EMC) issues, leading to increased size, weight, and manufacturing costs due to inadequate EMC measures during the design stage, which compromise the miniaturization and stability of the devices.
Innovation Solution
A solid state image sensing device with a wiring board configuration featuring adjacent and parallel high-potential and low-potential power supply lines, connected via power supply pads, to provide stable power supply and reduce electromagnetic interference, implemented using a flexible wiring board with specific power supply electric line arrangements to minimize electromagnetic induction.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If EMC measures such as shielding and multilayer board structures are implemented, then electromagnetic compatibility is improved, but device size and manufacturing cost increase
Solution Approach 1:
The patent transitions from planar 2D wiring to 3D stacked wiring architecture. Power supply lines are arranged in multiple layers vertically stacked above each other, with alternating high-potential and low-potential lines. This vertical stacking reduces the horizontal area required while maintaining effective EMC shielding through the close proximity of opposite polarity lines in three-dimensional space.
Solution Approach 2:
Multiple functions are merged into the wiring board structure: power supply distribution, electromagnetic shielding, and signal routing are integrated into a single multilayer board design. The wiring board simultaneously serves as the structural substrate, power distribution network, and EMC shielding mechanism, eliminating the need for separate shielding components.
2Reliability
If EMC measures such as shielding and multilayer board structures are implemented, then electromagnetic compatibility is improved, but manufacturing cost increases
Solution Approach 1:
The wiring board is designed as a universal component that performs multiple functions: power supply distribution to both the solid-state image sensor and integrated circuit chip, electromagnetic shielding through alternating high and low potential lines, and signal routing. This multi-functionality eliminates the need for separate EMC shielding components, reducing part count and assembly complexity.
Solution Approach 2:
EMC measures are built into the wiring board structure during the board fabrication process itself, before the actual device assembly. The alternating high and low potential lines are pre-arranged in the multilayer board construction, providing inherent electromagnetic shielding that works automatically without requiring additional post-assembly shielding components or complex routing modifications.
3Reliability
If power supply lines are arranged in parallel and adjacent configuration, then power supply stability is improved, but electromagnetic interference increases
Solution Approach 1:
The wiring board employs different wiring configurations for different regions and functions. Power supply lines use the alternating high-low potential arrangement for stability, while signal lines are routed in separate regions with appropriate spacing. Each layer and region is optimized for its specific function, with local wiring patterns tailored to minimize interference while maintaining power stability.
Solution Approach 2:
Low-potential lines serve as electromagnetic shields between high-potential lines and sensitive signal lines. The alternating arrangement creates intermediate shielding zones where the low-potential lines act as mediators, blocking electromagnetic fields from high-potential lines from interfering with adjacent circuits, thus reducing harmful electromagnetic radiation.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively enhances EMC noise resistance and operational stability while reducing the size and manufacturing costs of the device by efficiently transmitting power supply voltage and current, minimizing electromagnetic interference, and allowing for efficient layout design.
Implementation Method 1
A solid state image sensing device with a wiring board configuration featuring adjacent and parallel high-potential and low-potential power supply lines, connected via power supply pads, to provide stable power supply and reduce electromagnetic interference, implemented using a flexible wiring board with specific power supply electric line arrangements to minimize electromagnetic induction.
Data Source
AI summary
Each of a pair of power supply electric lines (11 and 12) connected to power supply pads of a solid state image sensor (1) and a pair of power supply electric lines (13 and 14) connected to power supply pads of an integrated circuit chip (2) is arranged so that the power supply electric lines included in each power supply electric line pair are in parallel with each other and has a very small gap between them. The power supply electric lines (11 to 14) have a certain width and bend portions that are curved smoothly with a predetermined curvature or less and are formed on a flexible wiring board (3). In each of the solid state image sensor (1) and the integrated circuit chip (2), the high-potential and low-potential power supply pads are arranged side by side.