Image Pickup Substrate Levelness via Flat Plate and Filler
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Solution Overview
Problem
The miniaturization of image pickup devices has led to challenges in maintaining the level of the image pickup element mounting substrate, causing inclination and misalignment issues due to variations in electronic component dimensions and mounting accuracy, resulting in optical axis misalignment and image noise.
Innovation Solution
An image pickup element mounting substrate with a frame body and a flat plate that covers a through hole, where the electronic component is mounted below the level of the flat plate, ensuring the substrate remains level and reducing inclination, and an image pickup device with a lid body sealing the interior.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of operation
If electronic components are mounted on the lower surface of the frame body to enable external circuit connection, then the upper surface can be connected with external circuits, but variations in component dimensions and mounting accuracy cause the lower surfaces of multiple electronic components to be non-flush, resulting in substrate inclination and optical axis misalignment
Solution Approach 1:
A filler material is introduced as an intermediary substance between the electronic components and the lower surface of the frame body. This filler material fills the gaps caused by variations in component dimensions and mounting inaccuracies, enabling the electronic components to be mounted on the lower surface while maintaining the flatness and levelness of the substrate, thus preventing optical axis misalignment and image noise.
2Volume of moving object
If the image pickup device is miniaturized to reduce size, then the device becomes more compact, but there is insufficient space to leave room for mounting external circuit connection electrodes and electronic components on the upper surface of the frame body
Solution Approach 1:
The patent relocates the mounting position of electronic components from the upper surface to the lower surface of the frame body, utilizing the third dimension (vertical space) to resolve the space constraint. This dimensional transition allows the upper surface to be dedicated to optical elements while the lower surface accommodates electronic components, enabling device miniaturization without compromising mounting capabilities.
3Manufacturing precision
If the lower surfaces of electronic components are made flush to maintain substrate levelness, then optical axis alignment is improved, but this requires extremely high mounting precision that is difficult to achieve due to component variations
Solution Approach 1:
The filler material serves as a compensatory intermediary that absorbs dimensional variations and mounting inaccuracies. By filling the gaps between electronic components and the frame body lower surface, it enables achieving flush mounting and optimal optical axis alignment without requiring extremely high mounting precision, thus simplifying the manufacturing process.
Solution Approach 2:
The invention changes the physical state or properties of the mounting interface by introducing a filler material that can adapt to dimensional variations. This parameter change allows the system to accommodate component tolerances and mounting inaccuracies while maintaining the required substrate levelness and optical alignment.
Data Source
AI summary
An image pickup element mounting substrate includes: a frame body composed of an insulating layer, a through hole being defined by an internal periphery of the frame body; an electronic component mounted on a lower surface side of the frame body; and a flat plate which is disposed on a lower surface of the frame body and covers an opening of the through hole while being partly kept in out-of-contact with the electronic component, the flat plate including an image pickup element mounting section at a part of an upper surface thereof which part is surrounded by the frame body, a lower surface of the electronic component being located above a level of a lower surface of the flat plate.