Molded Imager Carrier Alignment Marks for Lens Precision
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Solution Overview
Problem
Conventional microelectronic imager packaging faces challenges in accurately aligning lenses with image sensors, is time-consuming and prone to operator errors, and results in inefficient manufacturing and larger device sizes due to manual adjustments and separate assembly of components.
Innovation Solution
The use of a molded imager carrier with embedded alignment marks and a pre-packaged optics module with fixed optical components, allowing for precise alignment and focus setting during manufacturing, reducing manual adjustments and assembly complexity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of operation
If manual adjustment and separate assembly of components are used, then ease of operation is improved, but manufacturing precision and productivity deteriorate
Solution Approach 1:
Alignment marks are pre-formed on the carrier substrate at predetermined positions before the optics module is assembled. The lens and image sensor are positioned relative to these pre-existing marks, ensuring precise alignment without requiring manual adjustment during assembly. This preliminary preparation of alignment references resolves the contradiction by enabling high precision through automated processes rather than manual operation.
Solution Approach 2:
The carrier substrate serves as an intermediary component that integrates both the alignment marks and the mounting structures for the optics module. This intermediary element mediates between the lens and image sensor by providing a common reference framework, allowing precise relative positioning to be achieved through the intermediary's pre-established geometric relationships rather than direct manual alignment.
2Ease of operation
If manual adjustment and separate assembly of components are used, then ease of operation is improved, but productivity deteriorates
Solution Approach 1:
The carrier substrate is prepared in advance with alignment marks formed at predetermined positions. The optics module components are designed to be positioned relative to these pre-established marks, enabling automated assembly processes to achieve precise alignment without time-consuming manual adjustments. This preliminary preparation significantly improves manufacturing efficiency by eliminating repetitive manual operations.
Solution Approach 2:
The patent combines multiple functions into the carrier substrate: it serves as the mounting platform for the optics module, provides the alignment reference marks, and establishes the geometric relationships between components. By merging these functions into a single pre-prepared component, the assembly process is simplified and accelerated, resolving the productivity issue while maintaining ease of operation through standardized interfaces.
3Device complexity
If conventional separate assembly is used, then device complexity is reduced, but manufacturing precision deteriorates
Solution Approach 1:
Alignment marks are pre-formed on the carrier substrate at positions calculated to achieve the desired optical alignment. The lens and image sensor are then positioned relative to these pre-established marks, ensuring precise alignment without requiring complex adjustment mechanisms. This preliminary preparation of reference marks enables high precision while maintaining relatively simple assembly structure.
Solution Approach 2:
The carrier substrate acts as an intermediary that simplifies the overall device structure while enabling precise alignment. Instead of requiring complex adjustment mechanisms or post-assembly alignment procedures, the intermediary carrier provides pre-established geometric relationships that guide the positioning of all optical components, achieving high precision through structural design rather than operational complexity.
Data Source
AI summary
A method of packaging imager devices and optics modules is disclosed which includes positioning an imager device and an optics module in each of a plurality of openings in a carrier body, introducing an encapsulant material into each of the openings in the carrier body and cutting the carrier body to singulate the plurality of imager devices and optics modules into individual units, each of which comprise an imager device and an optics module. A device is also disclosed which includes an imager device comprising a plurality of photosensitive elements and an optics module coupled to the imager device, the optics module comprising at least one lens that, when the optics module is coupled to the imager device, is positioned a fixed, non-adjustable distance from the plurality of photosensitive elements.