Imager Head Thermal Dissipation via Conductive Interface
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Solution Overview
Problem
Analog remote inspection devices face challenges in conveying fine image detail due to limited data capacity and increased heat generation from higher power light sources, which complicates the imaging device configuration.
Innovation Solution
The imager head assembly incorporates a thermally conductive material in contact with both the circuit board and imager housing to create a conductive heat transfer path, dissipating heat generated by light emitting diodes, and includes a light transmissive light pipe unit to enhance heat dissipation and maintain image quality.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Illumination intensity
If high power light emitting diodes are used to illuminate the area of interest, then illumination intensity is improved, but heat generated by the light emitting diodes increases
Solution Approach 1:
The patent extracts the heat dissipation function from the traditional imaging head design by introducing a separate thermally conductive material layer between the circuit board and imager housing. This dedicated thermal management component removes heat away from the light emitting diodes without interfering with the illumination function, thereby maintaining high illumination intensity while controlling temperature rise.
Solution Approach 2:
The thermally conductive material serves as an intermediary between the heat-generating light emitting diodes on the circuit board and the imager housing. This intermediate layer facilitates efficient heat transfer from the LEDs to the housing structure, enabling thermal management while preserving the optical and electrical functions of the imaging system.
2Loss of information
If higher power light source is used to improve image detail, then illumination intensity is improved, but device complexity increases due to heat management requirements
Solution Approach 1:
The patent merges the structural housing function with the thermal management function by making the imager housing serve dual purposes: providing mechanical protection and structural support while simultaneously acting as a heat sink through the thermally conductive material interface. This integration reduces device complexity by eliminating the need for separate cooling components.
Solution Approach 2:
The imager housing is designed with multi-functionality, serving both as the protective enclosure for imaging components and as a thermal management component. The housing's dual role in structural support and heat dissipation simplifies the overall device configuration while enabling the use of high-power light sources for improved image detail.
3Temperature
If thermally conductive material is added to dissipate heat, then heat dissipation is improved, but manufacturing precision requirements increase
Solution Approach 1:
The thermally conductive material is applied locally at the critical interface between the circuit board and imager housing, specifically where heat transfer is most needed. This localized application focuses thermal management efforts on the heat-generating LED regions without requiring precision thermal management across the entire housing, thereby reducing overall manufacturing precision requirements.
Solution Approach 2:
The thermally conductive material is pre-applied to the circuit board or housing surface before final assembly. This preliminary action ensures proper thermal contact is established during assembly, compensating for minor surface irregularities and reducing the need for extremely precise manufacturing tolerances on the mating surfaces.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution effectively dissipates heat from high power light emitting diodes, preventing damage and improving the operational life cycle of the imager head assemblies while maintaining image quality by using thermally conductive materials and adhesives to enhance heat transfer.
Implementation Method 1
A thermally conductive material in contact with both the circuit board and the imager housing creates a conductive heat transfer path to dissipate heat generated by the light emitting diode through the imager housing
Implementation Method 2
A light transmissive light pipe unit is positioned proximate the circuit board to permit light emitted by the light emitting diode to pass through the light pipe unit
Data Source
AI summary
An imager head assembly for a remote inspection device includes an imager housing. A circuit board is positioned within the imager housing. The circuit board has a light emitting diode connected thereto. A thermally conductive material in contact with the circuit board and the imager housing creates a conductive heat transfer path to dissipate heat generated by the light emitting diode through the imager housing. A light transmissive light pipe unit can be positioned proximate the circuit board to permit light emitted by the light emitting diode to pass through the light pipe unit.