Microelectronic Imager Housing with Integrated Conductive Traces
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Solution Overview
Problem
Conventional microelectronic imagers require a separate interposer substrate, which limits their size and increases production costs due to complex and time-consuming manufacturing processes, making them unsuitable for smaller electronic devices.
Innovation Solution
The proposed method eliminates the need for a separate interposer substrate by using a pre-molded housing unit with integrated electrically conductive traces formed through a laser ablation process, allowing for a more compact and efficient manufacturing process without additional masks, tools, or solvents.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If a separate interposer substrate is used in conventional microelectronic imagers, then electrical pathways between bond-pads and external contacts are provided, but the size of the imager increases and production costs increase due to complex manufacturing processes
Solution Approach 1:
The patent merges the interposer substrate function with the housing unit by integrating electrically conductive traces directly into the housing. The housing unit now serves dual purposes: providing mechanical protection and establishing electrical pathways. This eliminates the separate interposer component and simplifies the manufacturing process by reducing the number of assembly steps and components.
Solution Approach 2:
The housing unit is designed to perform multiple functions simultaneously: it provides mechanical protection for the die, serves as a structural support, and establishes electrical pathways through integrated conductive traces. This multi-functionality eliminates the need for dedicated interposer substrates and reduces overall device complexity.
2Volume of moving object
If a separate interposer substrate is used, then electrical connections are established, but the imager size increases making it unsuitable for smaller electronic devices
Solution Approach 1:
By combining the electrical connection function with the housing unit through integrated conductive traces, the patent eliminates the need for a separate interposer substrate. This integration reduces the overall imager size while maintaining reliable electrical connections between the die bond-pads and external contacts through the housing's conductive trace network.
3Productivity
If conventional manufacturing processes with multiple components are used, then electrical pathways are established, but production time increases and productivity decreases
Solution Approach 1:
The electrically conductive traces are pre-formed as integral parts of the housing unit during housing manufacturing, before the die assembly process. This preliminary action eliminates the need for separate interposer fabrication and assembly steps, significantly reducing production time and increasing manufacturing productivity.
Solution Approach 2:
The integration of conductive traces into the housing unit merges multiple manufacturing operations into a single streamlined process. Instead of separately fabricating interposers, attaching them to housings, and then assembling dies, the patent combines these functions into one integrated housing unit, reducing assembly steps and improving productivity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach results in a smaller, more robust microelectronic imager with reduced production costs and increased efficiency, enabling their use in smaller devices while minimizing the risk of contamination and damage to delicate components.
Implementation Method 1
A laser is used to ablate material from a housing unit in a desired pattern to form electrically conductive traces
Data Source
AI summary
Microelectronic imagers and methods of manufacturing such microelectronic imagers are disclosed. In one embodiment, a method for manufacturing a microelectronic imager can include irradiating selected portions of an imager housing unit. The housing unit includes a body having lead-in surfaces and a support surface that define a recess sized to receive a microelectronic die. The method also includes depositing a conductive material onto the irradiated portions of the housing unit and forming electrically conductive traces. The method further includes coupling a plurality of terminals at a front side of a microelectronic die to corresponding electrically conductive traces in the recess in a flip-chip configuration. The microelectronic die includes an image sensor aligned with at least a portion of an optical element carried by the housing unit and at least partially aligned with the recess. The method can then include depositing an encapsulant into the recess and over at least a portion of the microelectronic die.