Imager Module Interposer Chip Vibration Isolation
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Solution Overview
Problem
Imaging systems in compact user devices like smartphones face challenges due to limited space and vulnerability to vibrations and mechanical shocks, which affect the reliability and performance of semiconductor image sensors.
Innovation Solution
An imager module with an interposer chip is introduced, which includes a silicon interposer chip between the image sensor and the printed circuit board, using through silicon vias (TSVs) for signal routing and attachment methods like flip-chip bonding, enabling robust signal transmission and mechanical stability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If the image sensor is directly mounted on the printed circuit board to reduce device volume, then the form factor is compact, but the system becomes vulnerable to vibrations and mechanical shocks
Solution Approach 1:
A silicon interposer chip is introduced as an intermediary component between the image sensor and the printed circuit board. The interposer chip provides mechanical decoupling and stress relief, allowing the image sensor to be mounted in a compact configuration while protecting it from vibrations and mechanical shocks transmitted through the PCB.
Solution Approach 2:
The mounting structure is segmented into three distinct components: the image sensor, the silicon interposer chip, and the printed circuit board. This segmentation allows each component to be optimized independently - the interposer chip can be designed specifically for vibration isolation while maintaining compact overall dimensions.
2Device complexity
If traditional wiring methods are used to connect the image sensor to the PCB, then the design is simple, but the imager module size increases and reliability decreases
Solution Approach 1:
Traditional mechanical wiring connections are replaced with a semiconductor-based interposer chip that provides electrical connections through integrated circuits and bonding techniques. This substitution eliminates the need for bulky wire harnesses and complex routing, significantly reducing the imager module volume while maintaining connection integrity.
3Device complexity
If the image sensor is directly mounted on the PCB, then the structure is simple, but warpage occurs under thermal cycling conditions
Solution Approach 1:
The silicon interposer chip provides a homogeneous mounting surface with matched thermal expansion properties between the image sensor and the PCB. This homogeneity in material properties and thermal characteristics prevents differential expansion and contraction during thermal cycling, eliminating warpage issues.
Solution Approach 2:
The interposer chip acts as a thermal mediator between the image sensor and PCB, absorbing and distributing thermal stresses uniformly. This intermediary layer prevents direct thermal coupling that would cause warpage, maintaining structural stability under varying temperature conditions.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The imager module achieves a compact form factor and enhanced robustness against thermal cycling and vibrations, ensuring reliable image capture and reduced warpage, thus improving the reliability and efficiency of image sensors in compact devices.
Implementation Method 1
using through silicon vias (TSVs) for signal routing
Implementation Method 2
attachment methods like flip-chip bonding
Data Source
AI summary
An imager module having an interposer chip electrically connected to and routing signals between an image sensor, a printed circuit board (PCB), and a voice coil motor (VCM) is disclosed. In some example embodiments, one or more surface mount devices (SMDs) may further be attached to the interposer chip, the PCB, or both the interposer chip and the PCB. The interposer chip may further have a cavity therethrough to allow light to impinge in the image sensor. The interposer chip may still further have through silicon vias (TSVs) to route signals from the PCB to the VCM.