Microelectronic Imager Lens Alignment via Integral Reference Features
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Solution Overview
Problem
Conventional microelectronic imagers face challenges in accurately aligning lenses with image sensors due to misalignment issues and inefficient manual focusing, leading to increased manufacturing costs and potential defects from imperfect glass covers that can degrade image quality.
Innovation Solution
The method involves fixedly positioning optics supports with aligned openings and interface features relative to image sensors on a workpiece before singulation, allowing for precise alignment and adjustment of optical devices using rotatable interface features, and applying a filtering layer directly onto the image sensors to enhance image quality.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If conventional packaging methods with separate supports and threaded barrels are used, then assembly is simpler, but lens alignment precision with image sensor deteriorates
Solution Approach 1:
The patent merges the support structure and the optical device housing into a single integrated package structure. The package includes a support portion with a recess that directly receives and positions the optical device, eliminating the need for separate supports and threaded barrels. This integration ensures precise alignment between the lens and image sensor while simplifying the overall assembly process.
2Productivity
If manual rotation and adjustment of lens barrel is used, then focus distance can be adjusted, but manufacturing time and operator error increase
Solution Approach 1:
The patent incorporates preliminary positioning features directly into the package structure, including a stop component that pre-positions the optical device at the correct focus distance. This eliminates the need for manual rotation and adjustment during assembly, as the optical device is automatically positioned at the precise focus distance when installed in the recess. The stop component ensures consistent, accurate focus distance across all packaged imagers without operator intervention.
3Reliability
If glass covers are used to protect image sensors, then component protection is improved, but image quality deteriorates due to defects and imperfections
Solution Approach 1:
The patent extracts and eliminates the glass cover component from the imager package. By removing the glass cover, the invention directly addresses image quality degradation caused by defects, imperfections, and potential contamination in the glass material. The image sensor is protected through alternative means while maintaining optical clarity, thereby improving image quality without compromising component protection.
Data Source
AI summary
Microelectronic imager assemblies with optical devices having integral reference features and methods for assembling such microelectronic imagers is disclosed herein. In one embodiment, the imager assembly can include a workpiece with a substrate having a front side, a back side, and a plurality of imaging dies on and/or in the substrate. The imaging dies include image sensors, integrated circuitry operatively coupled to the image sensors, and external contacts electrically coupled to the integrated circuitry. The assembly also includes optics supports on the workpiece. The optics supports have openings aligned with corresponding image sensors and first interface features at reference locations relative to corresponding image sensors. The assembly further includes optical devices having optics elements and second interface features seated with corresponding first interface features to position the optics elements at a desired location relative to corresponding image sensors.