Microelectronic Imager Referencing Elements Lens Alignment

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Solution Overview

Problem

Conventional microelectronic imagers face challenges in accurately aligning lenses with image sensors, positioning lenses at precise focus distances, and have large footprints and high manufacturing costs due to manual and inefficient assembly processes.

Innovation Solution

The implementation of referencing elements, such as alignment and stop components, in both imaging and optics units that are interlocked to ensure precise alignment and positioning of lenses relative to image sensors, utilizing wafer-level processes for fabrication and assembly, and automated equipment for alignment and assembly, reducing manual intervention and enhancing precision.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Ease of manufacture

If conventional manual assembly processes are used for lens alignment and positioning, then ease of manufacture is improved, but manufacturing precision deteriorates

Engineering Contradiction:
Improveease of manufactureVSAvoidmanufacturing precision
Core Design Contradiction:
Ease of manufactureVSManufacturing precision

Solution Approach 1:

The patent replaces manual mechanical assembly with automated pick-and-place equipment that uses referencing elements (alignment marks and stop components) to achieve precise lens positioning. The automated system reads coordinates of alignment marks and mechanically positions the lens assembly with high precision based on these references, eliminating manual alignment while achieving superior manufacturing precision.

Inventive Principle:
Principle #28Mechanics substitution (Replace mechanical system)

Solution Approach 2:

The patent introduces referencing elements (alignment marks on the substrate and stop components on the lens assembly) as intermediaries to facilitate precise positioning. These referencing elements serve as mediators between the automated assembly equipment and the lens assembly, enabling the equipment to accurately locate and position the lens relative to the image sensor without direct manual intervention.

Inventive Principle:
Principle #24Intermediary (Mediator)

2Device complexity

If manual lens positioning is used, then device complexity is reduced, but productivity deteriorates

Engineering Contradiction:
Improvedevice complexityVSAvoidproductivity
Core Design Contradiction:
Device complexityVSProductivity

Solution Approach 1:

The patent incorporates alignment marks on the substrate and stop components on the lens assembly during the manufacturing process, before final assembly. These referencing elements are prepared in advance to guide the automated pick-and-place equipment, enabling rapid and precise lens positioning without complex real-time adjustments during assembly, thereby significantly improving productivity.

Inventive Principle:
Principle #10Preliminary action

3Ease of manufacture

If conventional packaging methods are used, then ease of manufacture is improved, but manufacturing cost deteriorates

Engineering Contradiction:
Improveease of manufactureVSAvoiddevice complexity
Core Design Contradiction:
Ease of manufactureVSDevice complexity

Solution Approach 1:

The patent replaces complex manual positioning operations with automated pick-and-place equipment that uses simple referencing elements (alignment marks and stop components). This substitution reduces the need for complex manual adjustment mechanisms and skilled labor, thereby reducing manufacturing costs while maintaining ease of manufacture through automated processes.

Inventive Principle:
Principle #28Mechanics substitution (Replace mechanical system)

Data Source

PatentUS7583862B2Packaged microelectronic imagers and methods of packaging microelectronic imagers
Publication Date: 2009.09.01 APTINA IMAGING CORP
  • US7583862B2 patent drawing
  • US7583862B2 patent drawing
  • US7583862B2 patent drawing

AI summary

A microelectronic imager having an imaging unit and an optics unit attached to the imaging unit, and methods for packaging microelectronic imagers. In one embodiment, the imaging unit can include a microelectronic die with an image sensor and a plurality of external contacts electrically coupled to the image sensor and a first referencing element fixed to the imaging unit. The optics unit can include an optic member and a second referencing element fixed to the optics unit. The second referencing element is seated with the first referencing element at a fixed, preset position in which the optic member is situated at a desired location relative to the image sensor.