Imaging Apparatus Miniaturization via Integrated Circuit Board and Molded Member
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Solution Overview
Problem
Miniaturization of imaging apparatuses often results in reduced optical performance and deteriorated image quality, making it undesirable to further miniaturize the imaging apparatus by solely reducing the size of components like lenses.
Innovation Solution
The implementation of a design that includes a first circuit board with an imaging element at its center, components on the outer circumference, and a molded member that incorporates these components, along with a lens barrel and infra red cut filter, which allows for the miniaturization while maintaining optical performance through a manufacturing process involving resin injection and reinforcement members.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If the lens and optical system are miniaturized, then the imaging apparatus size is reduced, but optical amount decreases and image quality deteriorates
Solution Approach 1:
The patent combines the lens holder, chip, and circuit board into a single integrated module structure. This merging allows for optimized spatial arrangement and light path management, enabling miniaturization while maintaining optical performance through consolidated design rather than separate component assembly.
Solution Approach 2:
The patent utilizes three-dimensional spatial arrangement and vertical stacking of components (lens, chip, circuit board) to reduce the horizontal footprint. By transitioning from a planar layout to a multi-layer vertical architecture, the imaging apparatus achieves compact size while preserving adequate optical path length and image quality.
2Volume of moving object
If components are sealed and integrated to miniaturize the module, then apparatus size is reduced, but assembly complexity increases
Solution Approach 1:
The lens holder, chip, and circuit board are pre-integrated into a unified module structure before final assembly. This preliminary integration establishes fixed spatial relationships and alignment between components, simplifying the subsequent sealing and assembly processes rather than requiring complex alignment operations at the final assembly stage.
Data Source
AI summary
The present technology relates to an imaging apparatus, a manufacturing apparatus, a manufacturing method, and an electronic appliance that contribute to miniaturization and thinning of an imaging apparatus. Provided is an imaging apparatus including a first circuit board in which an imaging element is mounted on a center portion, a component that is mounted on an outer circumference portion of the center portion of the first circuit board and a member that incorporates the component and is provided in the outer circumference portion and is formed by a mold method. The imaging apparatus further includes a lens barrel that holds a lens, in which a frame that supports a portion including the lens barrel is located on the member. Further, the frame includes an infra red cut filter (IRCF). The present technology can be applied to an imaging apparatus.