Solid-State Imaging Apparatus Optical Axis Alignment
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Solution Overview
Problem
In compound-eye system solid-state imaging apparatuses, optical axis mismatch between micro-lens arrays and imaging units occurs due to thermal expansion coefficient differences, leading to degradation in image quality, especially in high-temperature and high-humidity environments.
Innovation Solution
A solid-state imaging apparatus with a transparent material layer interposed between on-chip lenses and micro-lenses, eliminating the space between them and thus preventing optical axis mismatch, comprising a first intermediate layer with a refractive index different from the on-chip lens and a second intermediate layer with a refractive index different from the micro-lens, ensuring integral configuration without a space portion.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If a space portion is interposed between the micro-lens array and the imaging unit, then the manufacturing process is simplified, but optical axis mismatch occurs due to thermal expansion coefficient differences, degrading image quality
Solution Approach 1:
The patent merges the micro-lens array and imaging unit into an integral configuration where the micro-lens array is directly bonded to the imaging unit substrate, eliminating the space portion between them. This direct bonding prevents relative displacement caused by thermal expansion differences, thereby maintaining optical axis alignment and image quality stability while still allowing for manufacturability through direct bonding processes.
Solution Approach 2:
The patent introduces a transparent adhesive layer as an intermediary substance between the micro-lens array and the imaging unit. This adhesive layer serves as a bonding medium that directly connects the two components, eliminating the need for a separate space portion while maintaining optical transparency and preventing thermal expansion-induced misalignment.
2Ease of operation
If the micro-lens array and imaging unit are arranged through a space portion, then assembly is easier, but optical axis mismatch occurs in high-temperature and high-humidity environments
Solution Approach 1:
The patent merges the micro-lens array and imaging unit into a single integrated structure by directly bonding them together, eliminating the space portion that would allow relative movement. This integration ensures that thermal expansion and contraction occur as a unified system, preventing optical axis mismatch while maintaining assembly feasibility through direct bonding techniques.
Solution Approach 2:
The patent employs a composite structure consisting of the imaging unit substrate, transparent adhesive layer, and micro-lens array bonded together. This composite material approach creates a unified structure with coordinated thermal expansion properties, preventing differential expansion that would cause optical axis misalignment in varying temperature and humidity conditions.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration enhances image quality by preventing optical axis mismatch, maintaining high sensitivity and reducing flare ghost, even in challenging environmental conditions, and ensures superior image quality regardless of the usage environment.
Implementation Method 1
a transparent material layer that is pinched between the on-chip lenses and the micro-lens
Data Source
AI summary
The present technology relates to a solid-state imaging apparatus that can provide a compound-eye system solid-state imaging apparatus capable of capturing an image with high image quality regardless of use environments, a method of manufacturing a solid-state imaging apparatus, and an electronic apparatus. The solid-state imaging apparatus includes photoelectric conversion units (21) that are two-dimensionally arranged, on-chip lenses (27a) that are two-dimensionally arranged on an upper side of the photoelectric conversion units (21) in correspondence with the photoelectric conversion units (21), a micro-lens (10a) that is arranged so as to face each plurality of the on-chip lenses (27a), and a transparent material layer that is pinched between the on-chip lenses (27a) and the micro-lens (10a) and are configured by a first intermediate layer (29) and a second intermediate layer (31).