Imaging Apparatus Cooling via Optical Axis Duct and Fan
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Solution Overview
Problem
The miniaturization of imaging apparatuses is hindered by the need for effective heat dissipation, as existing heat dissipation structures based on natural or forced air cooling often result in increased size and potential for erroneous operations due to temperature rises.
Innovation Solution
An imaging apparatus design that incorporates a cooling unit with a duct thermally connected to both the imaging substrate and the control substrate, and a fan generating air flow for cooling, while ensuring that these components are placed along the optical axis direction without overlapping, thereby maintaining a compact form factor.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If a heat dissipation structure based on natural heat dissipation is used, then the device complexity is low, but the heat dissipation effectiveness is insufficient
Solution Approach 1:
The patent transitions from static natural heat dissipation to dynamic forced air cooling by introducing a fan that actively moves air through the duct system. This dynamic approach allows the heat dissipation system to adapt to varying heat generation levels by adjusting fan operation, thereby improving heat dissipation effectiveness while maintaining reasonable device complexity
Solution Approach 2:
The patent employs pneumatic principles by using a fan to generate air flow through a dedicated duct system. The duct is strategically positioned to channel air between the exterior member and control circuit substrate, creating an efficient forced convection heat dissipation pathway that overcomes the limitations of natural convection
2Loss of energy
If a duct is formed to extend from the back surface side to the front surface side and pass through the region between the control circuit substrate and the exterior member, then the heat dissipation effectiveness is improved, but the device complexity increases
Solution Approach 1:
The duct structure serves multiple functions simultaneously: it acts as a heat dissipation channel, a structural support element, and a space-efficient connector between components. By integrating the duct into the existing device architecture rather than adding it as a separate complex structure, the patent achieves effective heat dissipation while minimizing the increase in device complexity
Solution Approach 2:
The patent utilizes the Z-axis dimension (optical axis direction) by positioning the duct and fan in a direction perpendicular to the main substrate plane. This dimensional arrangement allows the heat dissipation system to operate in three-dimensional space without interfering with the two-dimensional layout of electronic components, thereby improving heat dissipation effectiveness while maintaining compact device complexity
3Loss of energy
If the imaging substrate, control substrate, and cooling unit are placed along the optical axis direction without overlapping, then the heat dissipation effectiveness is improved, but the device volume increases
Solution Approach 1:
The patent arranges the imaging substrate, control substrate, and cooling unit along the optical axis (Z-axis) direction, utilizing the third dimension for heat dissipation component placement. This vertical stacking approach allows all components to coexist in a compact footprint without overlapping in the X-Y plane, achieving effective heat dissipation while minimizing the overall device volume
Solution Approach 2:
The cooling unit components (duct and fan) are nested within the existing device structure along the optical axis, with the duct positioned between the exterior member and control circuit substrate. This nested arrangement allows the heat dissipation system to be integrated into the device's internal volume without requiring additional external space, thereby improving heat dissipation effectiveness while maintaining compact device volume
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration effectively dissipates heat from the imaging and control substrates, preventing temperature rises that could lead to erroneous operations, while also allowing for the miniaturization of the imaging apparatus by avoiding the need for larger heat dissipation structures.
Implementation Method 1
a fan thermally connected to the duct and configured to generate air flow for cooling the imaging substrate and the control substrate
Implementation Method 2
a duct thermally connected to the imaging substrate and the control substrate
Data Source
AI summary
An imaging apparatus includes an imaging sensor configured to capture an image, an imaging substrate on which the imaging sensor is mounted, a control substrate on which an electronic element configured to perform imaging processing of the imaging sensor is mounted, and a cooling unit, wherein the cooling unit includes a duct thermally connected to the imaging substrate and the control substrate, and a fan thermally connected to the duct and configured to generate air flow for cooling the imaging substrate and the control substrate, and wherein the imaging substrate, the control substrate, and the cooling unit are placed along an optical axis direction of the imaging sensor, without overlapping each other.