Solid-state imaging chip with side-mounted connections
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Solution Overview
Problem
Conventional solid-state imaging apparatuses are larger in size due to the need for a glass substrate and base portions that exceed the size of the CCD chip, hindering the reduction of size and weight, especially in portable devices like camera-included portable telephones, and have complex manufacturing processes that degrade productivity and increase costs.
Innovation Solution
A solid-state imaging apparatus with a light-receiving chip having light-receiving cells arranged on a base substrate, where a transparent protection plate covers the cells, with an area equal to or smaller than the chip, eliminating the need for a base portion and simplifying the manufacturing process by attaching and cutting the protection plate along with the chip from a wafer.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of operation
If a glass substrate larger than the CCD chip is used to provide connection area, then external device connection is enabled, but the area and size of the imaging apparatus increases
Solution Approach 1:
The patent moves the connection interface from the same plane as the CCD chip to the side surface of the glass substrate. By forming connection pads and conductive patterns on the lateral edges of the glass substrate rather than on its top surface, the connection function is achieved without increasing the footprint area of the glass substrate, thus resolving the contradiction between connection capability and area reduction.
2Stability of the object's composition
If a base portion larger than the CCD chip is provided for mounting, then mounting stability is improved, but the exterior size of the imaging apparatus increases
Solution Approach 1:
The patent replaces the conventional large base portion with a thin film sealing material that bonds the CCD chip to the glass substrate. This sealing material forms a compact bonding structure that provides sufficient mechanical stability without requiring a large base portion, thereby achieving mounting stability while minimizing the exterior dimensions of the imaging apparatus.
3Reliability
If separate mounting and sealing processes are used, then mounting reliability is improved, but manufacturing complexity and productivity increase
Solution Approach 1:
The patent combines the mounting and sealing functions into a single integrated process step. The sealing material simultaneously serves as the bonding agent that mounts the CCD chip to the glass substrate and as the sealing layer that protects the device. This merging of functions eliminates separate mounting and sealing processes, thereby improving productivity while maintaining mounting reliability through the use of specialized bonding/sealing materials.
4Area of stationary object
If the glass substrate area is reduced to match the CCD chip area, then the size of the imaging apparatus is reduced, but connection area becomes insufficient
Solution Approach 1:
The patent resolves this contradiction by relocating the connection interface to the side surface of the glass substrate. Connection pads and conductive patterns are formed on the lateral edges rather than on the top surface, enabling sufficient connection area to be achieved without increasing the footprint of the glass substrate, thus maintaining both compact size and adequate connection capability.
Data Source
AI summary
Provided is a light-receiving chip whose transparent protection plate has an area equal to or smaller than an area of the light-receiving chip, and which does not require a base portion for mounting. Provision of the light-receiving chip contributes to reduction in size and weight of cameras. In addition, provision of a solid-state imaging apparatus having excellent productivity contributes to reduction in price of cameras. A solid-state imaging apparatus (10) having: a solid-state imaging device (11) (a light-receiving chip) provided with a plurality of light-receiving cells arranged either one dimensionally or two dimensionally on one main surface of a base substrate; and a transparent protection plate (12) provided to cover a light-receiving area (18) (the plurality of light-receiving cells), where an area of the transparent protection plate is equal to or smaller than an area of the light-receiving chip, and a space (20) is formed between the light-receiving cells and the transparent protection plate.