Imaging Component Coordinate Calibration for Wafer Position Detection
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Solution Overview
Problem
Existing substrate position detection systems face challenges in accurately detecting and correcting the position of a wafer due to installation errors in the imaging component, which can lead to discrepancies between design-based and real positions, affecting precise detection and correction of wafer displacement.
Innovation Solution
A method for adjusting the coordinate position of the imaging component using a substrate position detection apparatus that involves supporting a mark-equipped wafer, detecting marks at multiple points while moving or rotating it, and calibrating axis directions and origin positions independently, allowing for precise adjustment without re-installing the imaging component.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If the coordinate position of the imaging component is determined based on design-based position, then the apparatus configuration is simple, but the position detection precision deteriorates due to installation errors
Solution Approach 1:
The patent replaces the mechanical/design-based coordinate determination system with an optical measurement system. The imaging component captures images of marks on the wafer, and the control unit calculates actual coordinates based on these images, substituting physical alignment procedures with optical detection and computational coordinate transformation.
Solution Approach 2:
The patent changes the coordinate parameters by calculating transformation values between the design-based coordinate system and the actual coordinate system. The control unit computes offset values and rotation angles based on mark positions, dynamically adjusting the coordinate parameters to compensate for installation errors without physical repositioning.
2Manufacturing precision
If the imaging component position is not adjusted, then the operation is simple, but the wafer position correction precision deteriorates
Solution Approach 1:
The system performs self-calibration by automatically detecting mark positions and computing coordinate transformations without requiring manual intervention for physical adjustment. The imaging component and control unit work together to self-correct for installation errors through automated image processing and coordinate calculation.
Solution Approach 2:
The patent performs preliminary coordinate calibration by detecting mark positions and calculating transformation parameters before actual wafer processing begins. This preliminary action establishes the correct coordinate relationship in advance, ensuring precise position correction during subsequent operations without requiring adjustments during production.
3Measurement precision
If a rotatable table with mark detection is used for coordinate adjustment, then the imaging component position can be adjusted, but the system complexity increases due to coupled movements
Solution Approach 1:
The patent extracts the coordinate measurement function from the mechanical positioning system. Instead of using a rotatable table that couples rotational and translational movements, the imaging component independently captures images, and the control unit separately calculates coordinate transformations, decoupling the measurement function from mechanical complexity.
Solution Approach 2:
The patent introduces mark-equipped wafers as intermediaries for coordinate calibration. These wafers with known mark patterns serve as mediators between the imaging component and the coordinate system, enabling precise coordinate determination without requiring complex mechanical adjustment mechanisms.
Data Source
AI summary
A method is disclosed for adjusting an arrangement of coordinates in an imaging area of an imaging component in a substrate imaging plane in a substrate position detection apparatus that detects a position of a substrate in accordance with an image taken of a circumferential portion of the substrate by the imaging component, the apparatus being arranged near a rotatable susceptor on which the substrate is placed and a substrate transferring apparatus prepared separately from the susceptor and configured to horizontally drive a supporting pin for transferring the substrate to and/or from the susceptor. This method includes supporting at a predetermined height above the susceptor by the supporting pin a mark-equipped wafer with a mark arranged corresponding to the circumferential portion of the substrate, bringing the mark into the imaging area, detecting the mark at plural points while horizontally moving the mark in one direction within the imaging area by a predetermined distance by horizontally driving the supporting pin, and calibrating an axis direction of the coordinates in accordance with a direction in which the plural points are arranged; and maintaining the mark-equipped wafer with a height adjustment jig at the predetermined height above the susceptor, bringing the mark into the imaging area, detecting the mark at plural points while moving the mark within the imaging area by a predetermined angle by rotating the susceptor, and calibrating an origin position of the coordinates in accordance with a rotation center obtained in accordance with the plural points.