Imaging Component Conductor Patterns for Thermal Stress Control

Solution Overview

Problem

Existing imaging components face challenges in maintaining high-density conductor routing while minimizing positional accuracy degradation and thermal stress, particularly under heat cycles, due to uneven substrate surfaces and thermal expansion issues.

Innovation Solution

The imaging component employs a laminated substrate with electrode pads and conductor patterns, where the conductor patterns have a widened portion below the pads to reduce substrate sinking and allow high-density routing, and the widened portion's shape matches the pads to distribute stress evenly, enhancing positional stability and thermal expansion control.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Productivity

If conductor patterns are routed at high density on the substrate surface, then routing capacity is improved, but positional accuracy degrades due to substrate sinking

Engineering Contradiction:

Improverouting capacityVSAvoidpositional accuracy

Core Design Contradiction:

ProductivityVSManufacturing precision

Solution Approach 1:

The conductor patterns are extended into the width direction (another dimension) to form widened portions below the electrode pads. This dimensional extension allows the conductor patterns to bear the pad weight and prevent substrate sinking without compromising the high-density routing capacity on the substrate surface.

Inventive Principle:

Principle #17Another dimension (Dimensionality change)

Solution Approach 2:

The conductor patterns are designed with non-uniform width, being widened in specific regions (below electrode pads) and maintaining narrow width in routing regions. This local quality variation allows different parts of the conductor pattern to serve different functions: weight bearing below pads and signal routing in other areas.

Inventive Principle:

Principle #3Local quality

2Stability of the object's composition

If conductor patterns are made wider to prevent substrate sinking, then structural stability is improved, but routing density decreases

Engineering Contradiction:

Improvestructural stabilityVSAvoidrouting density

Core Design Contradiction:

Stability of the object's compositionVSProductivity

Solution Approach 1:

The conductor patterns are designed with non-uniform width, being widened in specific regions (below electrode pads) and maintaining narrow width in routing regions. This local quality variation allows different parts of the conductor pattern to serve different functions: weight bearing below pads and signal routing in other areas.

Inventive Principle:

Principle #3Local quality

Solution Approach 2:

The conductor patterns are extended into the width direction (another dimension) to form widened portions below the electrode pads. This dimensional extension allows the conductor patterns to bear the pad weight and prevent substrate sinking without compromising the high-density routing capacity on the substrate surface.

Inventive Principle:

Principle #17Another dimension (Dimensionality change)

3Productivity

If electrode pads are densely arranged, then device integration is improved, but thermal stress increases under heat cycles

Engineering Contradiction:

Improvedevice integrationVSAvoidthermal stress

Core Design Contradiction:

ProductivityVSObject-affected harmful factors

Solution Approach 1:

The conductor patterns are designed with non-uniform width, being widened in specific regions (below electrode pads) and maintaining narrow width in routing regions. This local quality variation allows different parts of the conductor pattern to serve different functions: weight bearing below pads and signal routing in other areas.

Inventive Principle:

Principle #3Local quality

Solution Approach 2:

The imaging component uses a laminated substrate structure with resin layers and conductor patterns forming a composite material system. This composite structure helps distribute and reduce thermal stress under heat cycles while maintaining high device integration.

Inventive Principle:

Principle #40Composite materials

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This configuration reduces positional accuracy degradation and thermal stress, improving the reliability and stability of the imaging component by ensuring consistent conductor pattern placement and thermal expansion management under heat cycles.

Implementation Method 1

the conductor patterns have a widened portion below the pads to reduce substrate sinking and allow high-density routing, and the widened portion's shape matches the pads to distribute stress evenly, enhancing positional stability and thermal expansion control

Methodology Applied

Scientific EffectThermal expansion: Thermal Expansion

Data Source

PatentEP3277065B1Imaging component, and imaging module provided with same

Publication Date: 2021.08.11 KYOCERA CORP

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AI summary

An imaging component (10) includes a laminated substrate (1) formed of a resin material; a plurality of electrode pads (2) disposed on an upper face of the laminated substrate (1), an imaging element (4) being to be mounted on the plurality of electrode pads (2); and a plurality of conductor patterns (3) which are belt-shaped and disposed between layers of the laminated substrate (1), the plurality of conductor patterns (3) being connected to the plurality of electrode pads (2), respectively. A part of at least one of the plurality of conductor patterns (3) has a widened portion (31), the widened portion being located immediately below any of electrode pads which are not connected to the at least one of the plurality of conductor patterns.