Imaging Cooling Assembly With Overlapping Heat Sheets
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Solution Overview
Problem
Existing imaging apparatuses face challenges in increasing heat transfer from objects to be cooled to heat dissipation members without enlarging the contact surface area due to size restrictions.
Innovation Solution
The imaging apparatus employs a dual heat conductive sheet system with elastic members to bias overlapping heat absorbing and dissipating parts, allowing increased heat transfer without expanding the contact surface area.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If a heat conductive sheet is connected to an object to be cooled via a double-sided tape, then the structure is simple and easy to manufacture, but the thermal resistance increases and heat transfer efficiency decreases
Solution Approach 1:
The invention removes the double-sided tape from the heat conduction path entirely. The heat conductive sheet is directly attached to the object to be cooled without any adhesive layer, eliminating the thermal resistance introduced by the tape while maintaining ease of manufacture through direct bonding or mechanical fixation methods.
Solution Approach 2:
The invention introduces a heat conductive sheet as an intermediary component between the object to be cooled and the heat dissipation member. This sheet serves as a thermal bridge that efficiently conducts heat away from the object without requiring adhesive materials, thus improving heat transfer efficiency while maintaining structural simplicity.
2Loss of energy
If the contact surface between the heat conductive sheet and the object to be cooled is increased, then heat transfer efficiency improves, but the device size increases due to space restrictions
Solution Approach 1:
The invention transitions from a single-plane contact configuration to a multi-dimensional heat conduction structure. By stacking multiple heat conductive sheets in layers with overlapping arrangements, the system increases the effective contact surface area and thermal conduction paths in the vertical dimension without expanding the horizontal footprint of the device.
Solution Approach 2:
The invention employs a nested arrangement where multiple heat conductive sheets are stacked and overlapped, with each sheet positioned within the boundary of the previous one. This nested configuration maximizes the contact surface area for heat transfer while containing the entire structure within the same external dimensions, effectively increasing heat transfer efficiency without increasing device size.
3Loss of energy
If multiple heat conductive sheets are stacked to increase heat transfer, then heat transfer efficiency improves, but the device complexity increases
Solution Approach 1:
The invention merges multiple heat conductive sheets into a single integrated heat dissipation assembly. The stacked sheets are combined with the object to be cooled and heat dissipation member to form a unified thermal management system, where the individual sheets work together as a coordinated unit. This merging approach increases heat transfer efficiency through multiple conduction paths while avoiding the complexity of separate, independent cooling systems.
Solution Approach 2:
The stacked heat conductive sheets serve multiple functions simultaneously: they provide primary heat conduction from the object to be cooled, create redundant thermal paths for improved efficiency, and can be integrated with existing structural components of the device. This multi-functionality allows the system to achieve enhanced heat transfer without proportionally increasing overall device complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration enhances heat transfer efficiency by maintaining consistent contact and reducing thermal resistance, thereby improving cooling performance without increasing the surface area required.
Implementation Method 1
a heat conductive sheet that transfers heat from an object to be cooled to a heat dissipation member
Implementation Method 2
an elastic member that biases the first heat absorbing part and the second heat absorbing part and maintains connection between the first heat absorbing part and the object to be cooled and between the second heat absorbing part and the object to be cooled
Data Source
AI summary
An imaging apparatus includes an object to be cooled, a heat dissipation member, a first heat conductive sheet including a first heat absorbing part that absorbs heat from the object to be cooled and a first heat dissipating part that dissipates heat to the heat dissipation member, a second heat conductive sheet including a second heat absorbing part that absorbs heat from the object to be cooled and a second heat dissipating part that dissipates heat to the heat dissipation member, and an elastic member that biases the first heat absorbing part and the second heat absorbing part and maintains connection between the first heat absorbing part and the object to be cooled and between the second heat absorbing part and the object to be cooled. The elastic member biases the first heat absorbing part and the second heat absorbing part overlapping each other toward the object to be cooled.