Imaging Detector Scintillator Coupling via Material-Free Channels
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Solution Overview
Problem
Conventional scintillator-photodiode based imaging detectors in CT scanners face issues with optical adhesive voids and excess adhesive, leading to decreased light collection efficiency and mechanical challenges in coupling the scintillator and photodiode arrays, requiring expensive automation machinery.
Innovation Solution
The implementation of a scintillator array optically coupled to a photosensor array via an optical adhesive, with material-free channels to accommodate air and excess adhesive, ensuring complete filling of the gap between the light sensitive and non-sensitive regions, thereby preventing voids and improving alignment and light collection efficiency.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If optical adhesive is placed at junctions and scintillator array is lowered onto photodiode array, then mechanical coupling is achieved, but optical adhesive voids form and light collection efficiency decreases
Solution Approach 1:
The patent divides the coupling interface into multiple material-free channels distributed across the non-sensitive regions, allowing optical adhesive to flow through and fill the gap uniformly rather than being concentrated at junctions, preventing void formation while maintaining mechanical strength
Solution Approach 2:
The material-free channels act as intermediaries that guide the optical adhesive from the non-sensitive regions into the gap between light-sensitive regions and scintillator elements, ensuring complete filling without trapping air bubbles
2Strength
If scintillator array is lowered onto photodiode array with optical adhesive, then coupling is achieved, but excess adhesive squeezes out and requires removal
Solution Approach 1:
The patent extracts excess optical adhesive into the material-free channels during the coupling process, preventing it from squeezing out onto external surfaces and eliminating the need for post-assembly cleanup operations
3Ease of manufacture
If conventional coupling approach is used, then assembly can be performed, but fixtures and automation machinery are required increasing cost
Solution Approach 1:
The material-free channels enable the optical adhesive to self-distribute and self-align during assembly, allowing the scintillator array to be coupled to the photodiode array without requiring complex fixtures or automation machinery to control adhesive placement and gap filling
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution enhances light collection efficiency, reduces mechanical stress, and simplifies the assembly process by eliminating voids and excess adhesive issues, improving the overall performance and cost-effectiveness of the imaging detector.
Implementation Method 1
An optical adhesive is located in the gap, filling the entire gap, and mechanically and optically coupling the light sensitive region and the scintillator element
Implementation Method 2
The scintillator array absorbs x-ray photons and emits light photons indicative thereof
Implementation Method 3
the photodiode array receives the light photons and generates electrical signals indicative thereof and hence the absorbed x-ray photons
Data Source
Figure 1(A)~1(B)
Figure 2
Figure 3
AI summary
An imaging detector (214) includes a scintillator array (216) including a scintillator element (228) and a material (230) and a photosensor array (218) including a detector element (222) having a light sensitive region (224) and a non-sensitive region (226). The light sensitive region is separated from the scintillator element by a gap, the light sensitive region is in one-to-one mechanical alignment with the scintillator element, and the non- sensitive region is in mechanical alignment with the material. The detector further includes structure (234) that includes one or more material free channels. The structure is located between the non- sensitive region and the material and not between the light sensitive region and the scintillator element. An optical adhesive (232) is located in the gap, filling the entire gap, and mechanically and optically coupling the light sensitive region and the scintillator element.